Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6531083 | Sproutless pre-packaged molding for component encapsulation | Mario A. Bolanos, Jeremias L. Libres, George A. Bednarz, Tay LiangChee, Ireneus J. T. M. Pas | 2003-03-11 |
| 6214273 | Molding method with the use of modified runners | Chee Tay Liang, Jeremias P. Libres, Jin Sin Sai, Chee Moon Ow, Mario A. Bolanos-Avila | 2001-04-10 |
| 5912024 | Sproutless pre-packaged molding for component encapsulation | Mario A. Bolanos, Jeremias L. Libres, George A. Bednarz, Tay LiangChee, Ireneus J. T. M. Pas | 1999-06-15 |
| 5885506 | Pre-packaged molding for component encapsulation | Mario A. Bolanos, Jeremias L. Libres, Tay Liang Chee, Ireneus J. T. M. Pas | 1999-03-23 |