Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6531083 | Sproutless pre-packaged molding for component encapsulation | Mario A. Bolanos, Jeremias L. Libres, George A. Bednarz, Tay LiangChee, Ireneus J. T. M. Pas | 2003-03-11 | $36,232,000 |
| 6214273 | Molding method with the use of modified runners | Chee Tay Liang, Jeremias P. Libres, Jin Sin Sai, Chee Moon Ow, Mario A. Bolanos-Avila | 2001-04-10 | $39,664,000 |
| 5912024 | Sproutless pre-packaged molding for component encapsulation | Mario A. Bolanos, Jeremias L. Libres, George A. Bednarz, Tay LiangChee, Ireneus J. T. M. Pas | 1999-06-15 | $34,274,000 |
| 5885506 | Pre-packaged molding for component encapsulation | Mario A. Bolanos, Jeremias L. Libres, Tay Liang Chee, Ireneus J. T. M. Pas | 1999-03-23 | $57,612,000 |