| 7591955 |
Method for forming an etched soft edge metal foil and the product thereof |
David W. West, Christopher Machado, Christopher M. Sullivan |
2009-09-22 |
| 6365974 |
Flex circuit substrate for an integrated circuit package |
Donald C. Abbott, Robert Sabo, Steve Smith, Christopher M. Sullivan, David W. West |
2002-04-02 |
| 6302672 |
Integrated circuit chip mold seal |
Daniel Troiano |
2001-10-16 |
| 6302673 |
Integrated circuit chip mold seal |
Daniel Troiano |
2001-10-16 |
| 5949132 |
Dambarless leadframe for molded component encapsulation |
Jeremias L. Libres, Mario A. Bolanos, Ireneus J. T. M. Pas |
1999-09-07 |
| 5942178 |
Integrated circuit chip mold seal |
Daniel Troiano |
1999-08-24 |
| 5904503 |
Method of forming flat inner lead tips on lead frame |
Christopher M. Sullivan |
1999-05-18 |
| 5891377 |
Dambarless leadframe for molded component encapsulation |
Jeremias L. Libres, Mario A. Bolanos, Ireneus J. T. M. Pas |
1999-04-06 |
| 5672915 |
Ceramic coated plastic package |
Donald C. Abbott |
1997-09-30 |
| 5633528 |
Lead frame structure for IC devices with strengthened encapsulation adhesion |
Donald C. Abbott |
1997-05-27 |
| 5610437 |
Lead frame for integrated circuits |
— |
1997-03-11 |
| 5429992 |
Lead frame structure for IC devices with strengthened encapsulation adhesion |
Donald C. Abbott |
1995-07-04 |
| 5302553 |
Method of forming a coated plastic package |
Donald C. Abbott |
1994-04-12 |
| 5264376 |
Method of making a thin film solar cell |
Donald C. Abbott, Bawa S. Mohendra |
1993-11-23 |
| 4868635 |
Lead frame for integrated circuit |
Eugenijus Uzpurvis |
1989-09-19 |