Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362236 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Ming-Che Ho, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2016-06-07 |
| 8424357 | Easily stackable dies | Leo Lu, Kuei-Wu Chu | 2013-04-23 |
| 8416576 | Integrated circuit card | Tse Min Chu | 2013-04-09 |
| 8184464 | Flash memory | Kuei-Wu Chu, Leo Lu | 2012-05-22 |
| 8049323 | Chip holder with wafer level redistribution layer | Chen-Shien Chen, Chao-Hsiang Yang, Han-Liang Tseng, Mirng-Ji Lii, Tjandra Winata Karta +1 more | 2011-11-01 |
| 7838424 | Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching | Tjandra Winata Karta, Steven Hsu, Chien-Hsiun Lee, Gene Wu | 2010-11-23 |
| 7642129 | Ball-mounting method for coplanarity improvement in large package | Gene Wu, Steven Hsu | 2010-01-05 |
| 7056767 | Method and apparatus for flip chip device assembly by radiant heating | Kevin Jin, T. T. Chiu | 2006-06-06 |
| 6265769 | Double-sided chip mount package | Johnny Cheng, Justin Taekwon KONG | 2001-07-24 |
| 5644168 | Mechanical interlocking of fillers and epoxy/resin | Jeremias P. Libres, Abbas Ismail Attarwala, Mario A. Bolanos, Indran B. Nair | 1997-07-01 |