Issued Patents All Time
Showing 1–25 of 370 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388003 | Chip package structure with metal-containing layer | Yu-Huan Chen, Kuo-Ching Hsu | 2025-08-12 |
| 12376317 | Semiconductor device structure with magnetic element | Chi-Cheng Chen, Wei-Li Huang, Chien-Chih Kuo, Hon-Lin Huang, Chin-Yu Ku | 2025-07-29 |
| 12368120 | Semiconductor device and method | Ting-Li Yang, Po-Hao Tsai, Chien-Chen Li, Ming-Da Cheng | 2025-07-22 |
| 12347722 | Semiconductor device structure with a protection cap at an end portion of a conductive line | Ting-Li Yang, Wei-Li Huang, Sheng-Pin Yang, Chi-Cheng Chen, Hon-Lin Huang +1 more | 2025-07-01 |
| 12334489 | Lthc as charging barrier in info package formation | Yi-Jen Lai, Chung-Yi Lin, Hsi-Kuei Cheng, Kuo-Chio Liu | 2025-06-17 |
| 12334476 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Wei Sen Chang, Shou-Cheng Hu | 2025-06-17 |
| 12327782 | Systems for semiconductor package mounting with improved co-planarity | Wen-Yi Lin, Kuang-Chun Lee, Chien-Chen Li | 2025-06-10 |
| 12300644 | Die bonding pads and methods of forming the same | Wen-Hsiung Lu, Ming-Da Cheng, Chia-Li Lin, Yu-Chih Huang | 2025-05-13 |
| 12300652 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chung-Shi Liu | 2025-05-13 |
| 12293951 | Semiconductor package structure having ring portion with recess for adhesive | Hui-Ting Lin, Chin-Fu Kao | 2025-05-06 |
| 12159812 | Method of forming semiconductor device | Cheng-Lung Yang, Chih-Hung Su, Hon-Lin Huang, Kun-Ming Tsai, Wei-Je Lin | 2024-12-03 |
| 12131974 | Semiconductor package and method of manufacturing semiconductor package | Chin-Fu Kao | 2024-10-29 |
| 12125715 | Chip package structure with nickel layer | Kuo-Ching Hsu, Yu-Huan Chen | 2024-10-22 |
| 12119237 | Semiconductor device package having metal thermal interface material | Chien-Li Kuo, Chin-Fu Kao | 2024-10-15 |
| 12119276 | Package structure with protective lid | Wen-Yi Lin, Kuang-Chun Lee, Chien-Chen Li | 2024-10-15 |
| 12113055 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo | 2024-10-08 |
| 12087718 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Yen-Liang Lin | 2024-09-10 |
| 12074193 | Semiconductor device structure with magnetic element | Chi-Cheng Chen, Wei-Li Huang, Chun-Yi Wu, Kuang-Yi Wu, Hon-Lin Huang +2 more | 2024-08-27 |
| 12051634 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2024-07-30 |
| 12046588 | Package on package structure | Dong Shen, Kuo-Chio Liu, Hsi-Kuei Cheng, Yi-Jen Lai | 2024-07-23 |
| 12040289 | Interposer including a copper edge seal ring structure and methods of forming the same | Hong-Seng Shue, Ming-Da Cheng, Ching-Wen Hsiao, Yao-Chun Chuang, Yu-Tse Su | 2024-07-16 |
| 12027435 | Packages including multiple encapsulated substrate blocks and overlapping redistribution structures | Kuo-Ching Hsu, Wei-Hung Lin, Hui-Min Huang, Ming-Da Cheng, Mirng-Ji Lii | 2024-07-02 |
| 12019097 | Method for forming probe head structure | Wen-Yi Lin, Hao Chen, Chuan-Hsiang Sun, Mill-Jer Wang, Chien-Chen Li | 2024-06-25 |
| 12002746 | Chip package structure with metal-containing layer | Yu-Huan Chen, Kuo-Ching Hsu | 2024-06-04 |
| 11984419 | Package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2024-05-14 |