Issued Patents All Time
Showing 51–75 of 370 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631993 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chen-Hua Yu, Chita Chuang, Ming Hung Tseng, Sen-Kuei Hsu, Yu-Feng Chen +1 more | 2023-04-18 |
| 11621317 | Semiconductor device structure with magnetic element covered by polymer material | Chi-Cheng Chen, Wei-Li Huang, Chun-Yi Wu, Kuang-Yi Wu, Hon-Lin Huang +2 more | 2023-04-04 |
| 11557508 | Semiconductor device structure having protection caps on conductive lines | Ting-Li Yang, Wei-Li Huang, Sheng-Pin Yang, Chi-Cheng Chen, Hon-Lin Huang +1 more | 2023-01-17 |
| 11488878 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2022-11-01 |
| 11476125 | Multi-die package with bridge layer | Wei Sen Chang, Yu-Feng Chen, Mirng-Ji Lii | 2022-10-18 |
| 11469203 | Method for forming package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2022-10-11 |
| 11437361 | LTHC as charging barrier in InFO package formation | Yi-Jen Lai, Lin Chung-Yi, Hsi-Kuei Cheng, Kuo-Chio Liu | 2022-09-06 |
| 11404341 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2022-08-02 |
| 11387168 | Semiconductor devices | Cheng-Lung Yang, Chih-Hung Su, Hon-Lin Huang, Kun-Ming Tsai, Wei-Je Lin | 2022-07-12 |
| 11387171 | Method of packaging a semiconductor die | Hui-Min Huang, Shou-Cheng Hu, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2022-07-12 |
| 11342253 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chih-Hua Chen, Chen-Cheng Kuo | 2022-05-24 |
| 11335634 | Chip package structure and method for forming the same | Yu-Huan Chen, Kuo-Ching Hsu | 2022-05-17 |
| 11329124 | Semiconductor device structure with magnetic element | Chin-Yu Ku, Chi-Cheng Chen, Hon-Lin Huang, Wei-Li Huang, Chun-Yi Wu | 2022-05-10 |
| 11329008 | Method for manufacturing semiconductor package for warpage control | Ming-Da Cheng, Ming-Chih Yew, Yu-Tse Su | 2022-05-10 |
| 11315896 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Mirng-Ji Lii, Chen-Hua Yu, Sheng-Yu Wu, Yao-Chun Chuang | 2022-04-26 |
| 11302537 | Chip package structure with conductive adhesive layer and method for forming the same | Kuo-Ching Hsu, Yu-Huan Chen | 2022-04-12 |
| 11257797 | Package on package structure | Dong Shen, Kuo-Chio Liu, Hsi-Kuei Cheng, Yi-Jen Lai | 2022-02-22 |
| 11244940 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Cheng Kuo | 2022-02-08 |
| 11244919 | Package structure and method of fabricating the same | Ching-Wen Hsiao, Kuo-Ching Hsu, Mirng-Ji Lii | 2022-02-08 |
| 11233116 | Semiconductor device structure with magnetic element | Chi-Cheng Chen, Wei-Li Huang, Chien-Chih Kuo, Hon-Lin Huang, Chin-Yu Ku | 2022-01-25 |
| 11217562 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Wei Sen Chang, Shou-Cheng Hu | 2022-01-04 |
| 11152319 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang, Kai Jun Zhan | 2021-10-19 |
| 11133274 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu +2 more | 2021-09-28 |
| 11127703 | Semiconductor devices | Chin-Yu Ku, Cheng-Lung Yang, Hon-Lin Huang, Chao-Yi Wang, Ching-Hui Chen +1 more | 2021-09-21 |
| 11127704 | Semiconductor device with bump structure and method of making semiconductor device | Pei-Haw Tsao, Cheng-Hung Tsai, Kuo-Chin Chang, Li-Huan Chu | 2021-09-21 |