Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412857 | Hybrid micro-bump integration with redistribution layer | Ting-Li Yang, Po-Hao Tsai, Yi-Wen Wu, Hao-Chun Liu | 2025-09-09 |
| 12347722 | Semiconductor device structure with a protection cap at an end portion of a conductive line | Ting-Li Yang, Wei-Li Huang, Chi-Cheng Chen, Hon-Lin Huang, Chin-Yu Ku +1 more | 2025-07-01 |
| 11855028 | Hybrid micro-bump integration with redistribution layer | Ting-Li Yang, Po-Hao Tsai, Yi-Wen Wu, Hao-Chun Liu | 2023-12-26 |
| 11557508 | Semiconductor device structure having protection caps on conductive lines | Ting-Li Yang, Wei-Li Huang, Chi-Cheng Chen, Hon-Lin Huang, Chin-Yu Ku +1 more | 2023-01-17 |
| 11069652 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2021-07-20 |
| 10748810 | Method of manufacturing an integrated inductor with protections caps on conductive lines | Ting-Li Yang, Wei-Li Huang, Chi-Cheng Chen, Hon-Lin Huang, Chin-Yu Ku +1 more | 2020-08-18 |
| 10566204 | Etching and mechanical grinding film-layers stacked on a semiconductor substrate | Jian Jun Kong, She Yu Tang, Tian Yi Zhang, Qin Xu Yu | 2020-02-18 |
| 10535629 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2020-01-14 |
| 10269703 | Semiconductor device and method of forming the same | Chin-Yu Ku, Chen-Shien Chen, Hon-Lin Huang, Chien-Chih Chou, Ting-Li Yang | 2019-04-23 |
| 10249504 | Etching and mechanical grinding film-layers stacked on a semiconductor substrate | Jian Jun Kong, She Yu Tang, Tian Yi Zhang, Qin Xu Yu | 2019-04-02 |
| 10163849 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2018-12-25 |
| 9799625 | Semiconductor structure and manufacturing method thereof | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2017-10-24 |