Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412857 | Hybrid micro-bump integration with redistribution layer | Po-Hao Tsai, Yi-Wen Wu, Sheng-Pin Yang, Hao-Chun Liu | 2025-09-09 |
| 12368120 | Semiconductor device and method | Chen-Shien Chen, Po-Hao Tsai, Chien-Chen Li, Ming-Da Cheng | 2025-07-22 |
| 12347722 | Semiconductor device structure with a protection cap at an end portion of a conductive line | Wei-Li Huang, Sheng-Pin Yang, Chi-Cheng Chen, Hon-Lin Huang, Chin-Yu Ku +1 more | 2025-07-01 |
| 12266593 | Method of forming semiconductor device having at least one via including concave portions on sidewall | Wen-Hsiung Lu, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku | 2025-04-01 |
| 12243837 | Semiconductor device and method | Po-Hao Tsai, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang | 2025-03-04 |
| 12057423 | Bump integration with redistribution layer | Po-Hao Tsai, Ching-Wen Hsiao, Hong-Seng Shue, Ming-Da Cheng | 2024-08-06 |
| 11955423 | Semiconductor device and method | Po-Hao Tsai, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang | 2024-04-09 |
| 11942398 | Semiconductor device having at least one via including concave portions on sidewall | Wen-Hsiung Lu, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku | 2024-03-26 |
| 11908790 | Chip structure with conductive via structure and method for forming the same | Po-Hao Tsai, Ching-Wen Hsiao, Hong-Seng Shue, Yu-Tse Su | 2024-02-20 |
| 11901266 | Semiconductor device structure and method for forming the same | Wen-Hsiung Lu, Lung-Kai Mao, Fu Wei Liu, Mirng-Ji Lii | 2024-02-13 |
| 11862588 | Semiconductor device and method | Chen-Shien Chen, Po-Hao Tsai, Chien-Chen Li, Ming-Da Cheng | 2024-01-02 |
| 11851321 | Micro-electro mechanical system and manufacturing method thereof | Kai-Di Wu, Ming-Da Cheng, Wen-Hsiung Lu, Cheng-Jen Lin, Chin Wei Kang | 2023-12-26 |
| 11855028 | Hybrid micro-bump integration with redistribution layer | Po-Hao Tsai, Yi-Wen Wu, Sheng-Pin Yang, Hao-Chun Liu | 2023-12-26 |
| 11855017 | Semiconductor device and method | Po-Hao Tsai, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang | 2023-12-26 |
| 11557508 | Semiconductor device structure having protection caps on conductive lines | Wei-Li Huang, Sheng-Pin Yang, Chi-Cheng Chen, Hon-Lin Huang, Chin-Yu Ku +1 more | 2023-01-17 |
| 10748810 | Method of manufacturing an integrated inductor with protections caps on conductive lines | Wei-Li Huang, Sheng-Pin Yang, Chi-Cheng Chen, Hon-Lin Huang, Chin-Yu Ku +1 more | 2020-08-18 |
| 10269703 | Semiconductor device and method of forming the same | Chin-Yu Ku, Sheng-Pin Yang, Chen-Shien Chen, Hon-Lin Huang, Chien-Chih Chou | 2019-04-23 |
| 10252363 | Forming a solder joint between metal layers | Toyohiro Aoki, Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama | 2019-04-09 |
| 9586281 | Forming a solder joint between metal layers | Toyohiro Aoki, Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama | 2017-03-07 |