Issued Patents All Time
Showing 25 most recent of 304 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12385851 | Management system, management device, management method, and program | Keita SAJI, Mayuko Tanaka | 2025-08-12 |
| 12385110 | Pure copper plate | Yuki Ito, Hiroyuki Matsukawa, Norihisa Iida, Motohiro Hitaka | 2025-08-12 |
| 12359284 | Copper alloy, plastically worked copper alloy material, component for electronic/electrical equipment, terminal, heat dissipation substrate | Hirotaka Matsunaga, Kosei Fukuoka, Kazunari Maki, Kenji Morikawa, Shinichi Funaki | 2025-07-15 |
| 12364044 | Solid-state imaging apparatus and electronic apparatus | Tetsuya Uchida, Ryoji Suzuki, Hisahiro ANSAI, Yoichi Ueda, Shinichi Yoshida +6 more | 2025-07-15 |
| 12342455 | Layer-to-layer registration measurement mark | — | 2025-06-24 |
| 12331386 | Pure copper plate | Hirotaka Matsunaga, Yuki Ito, Norihisa Iida, Motohiro Hitaka | 2025-06-17 |
| 12241496 | Member for fastening and method of manufacturing same | Hideaki Matsuoka, Gaku Kitahara, Tatsuyuki Amago, Jun Yaokawa, Kyosuke IZUNO +3 more | 2025-03-04 |
| 12203158 | Copper alloy, copper alloy plastic working material, component for electronic/electrical device, terminal, bus bar, lead frame, and heat dissipation substrate | Hirotaka Matsunaga, Kosei Fukuoka, Kazunari Maki, Kenji Morikawa, Shinichi Funaki | 2025-01-21 |
| 12173382 | Combustion ash handling method and system, and petroleum-based fuel combustion plant | Seiji TABATA, Suguru Yabara, Tomohiro Osawa | 2024-12-24 |
| 12142603 | Bonding of bridge to multiple semiconductor chips | Akihiro Horibe, Takahito Watanabe, Toyohiro Aoki, Takashi Hisada | 2024-11-12 |
| 12127342 | Metal base substrate, electronic component mounting substrate | Fumiaki Ishikawa, Shintaro Hara, Kosei Fukuoka | 2024-10-22 |
| 12107097 | Solid-state imaging device and electronic apparatus | Tetsuya Uchida, Ryoji Suzuki, Yoshiharu Kudoh, Harumi Tanaka | 2024-10-01 |
| 12087596 | Controlling of height of high-density interconnection structure on substrate | Keishi Okamoto, Akihiro Horibe | 2024-09-10 |
| 12035469 | Pure copper plate, copper/ceramic bonded body, and insulated circuit board | Hirotaka Matsunaga, Yuki Ito | 2024-07-09 |
| 11888008 | Solid-state imaging apparatus and electronic apparatus | Tetsuya Uchida, Ryoji Suzuki, Hisahiro ANSAI, Yoichi Ueda, Shinichi Yoshida +6 more | 2024-01-30 |
| 11795525 | Copper alloy plate, copper alloy plate with plating film, and manufacturing method thereof | Naoki Miyashima, Takanori Kobayashi, Kazunari Maki, Shinichi Funaki, Yuki Ito | 2023-10-24 |
| 11791270 | Direct bonded heterogeneous integration silicon bridge | Kamal K. Sikka, Maryse Cournoyer, Pascale Gagnon, Charles C. Bureau, Catherine Dufort +8 more | 2023-10-17 |
| 11735575 | Bonding of bridge to multiple semiconductor chips | Akihiro Horibe, Takahito Watanabe, Toyohiro Aoki, Takashi Hisada | 2023-08-22 |
| 11735529 | Side pad anchored by next adjacent via | Takahito Watanabe, Risa Miyazawa | 2023-08-22 |
| 11732329 | Copper alloy, copper alloy plastic-processed material, component for electronic and electric devices, terminal, bus bar, and heat-diffusing substrate | Hirotaka Matsunaga, Yuki Ito, Hiroyuki Matsukawa | 2023-08-22 |
| 11725258 | Copper alloy for electronic/electrical devices, copper alloy planar bar stock for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar | Hirotaka Matsunaga, Yuki Ito, Hiroyuki Matsukawa | 2023-08-15 |
| 11660026 | Restoring a wearable biological sensor | Keiji Matsumoto, Takahito Watanabe, Eiji Nakamura, Patrick Ruch | 2023-05-30 |
| 11655523 | Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar | Hirotaka Matsunaga, Kenichiro Kawasaki, Kazunari Maki, Yoshiteru Akisaka | 2023-05-23 |
| 11652115 | Solid-state imaging device and electronic apparatus | Tetsuya Uchida, Ryoji Suzuki, Yoshiharu Kudoh, Harumi Tanaka | 2023-05-16 |
| 11574817 | Fabricating an interconnection using a sacrificial layer | Takahito Watanabe, Risa Miyazawa | 2023-02-07 |