Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087596 | Controlling of height of high-density interconnection structure on substrate | Akihiro Horibe, Hiroyuki Mori | 2024-09-10 |
| 11456269 | Prevention of bridging between solder joints | Risa Miyazawa, Takahito Watanabe, Hiroyuki Mori | 2022-09-27 |
| 11264314 | Interconnection with side connection to substrate | Risa Miyazawa, Takahito Watanabe, Hiroyuki Mori | 2022-03-01 |
| 11114308 | Controlling of height of high-density interconnection structure on substrate | Akihiro Horibe, Hiroyuki Mori | 2021-09-07 |
| 11004819 | Prevention of bridging between solder joints | Risa Miyazawa, Takahito Watanabe, Hiroyuki Mori | 2021-05-11 |
| 10643910 | Fabrication of a sacrificial interposer test structure | Hiroyuki Mori | 2020-05-05 |
| 10622311 | High-density interconnecting adhesive tape | Akihiro Horibe, Hiroyuki Mori | 2020-04-14 |
| 10595399 | Method of reducing warpage of an organic substrate | Sayuri Hada, Hiroyuki Mori | 2020-03-17 |
| 10529665 | High-density interconnecting adhesive tape | Akihiro Horibe, Hiroyuki Mori | 2020-01-07 |
| 10141278 | Chip mounting structure | Akihiro Horibe, Keiji Matsumoto, Kazushige Toriyama | 2018-11-27 |
| 10109540 | Fabrication of sacrificial interposer test structure | Hiroyuki Mori | 2018-10-23 |
| 10090586 | Wireless communication device with joined semiconductors | Toyohiro Aoki, Noam Kaminski, Kazushige Toriyama | 2018-10-02 |
| 9967971 | Method of reducing warpage of an orgacnic substrate | Sayuri Hada, Hiroyuki Mori | 2018-05-08 |
| 9941230 | Electrical connecting structure between a substrate and a semiconductor chip | Keiji Matsumoto, Yasumitsu Orii, Kazushige Toriyama | 2018-04-10 |
| 9893031 | Chip mounting structure | Akihiro Horibe, Keiji Matsumoto, Kazushige Toriyama | 2018-02-13 |
| 9780442 | Wireless communication device with joined semiconductors | Toyohiro Aoki, Noam Kaminski, Kazushige Toriyama | 2017-10-03 |
| 9772462 | Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide | Hirokazu Noma, Masao Tokunari, Kazushige Toriyama, Yutaka Tsukada | 2017-09-26 |
| 9760002 | Circuit board formation using organic substrates | Hiroyuki Mori, Hirokazu Noma | 2017-09-12 |
| 9684237 | Circuit board formation using organic substrates | Hiroyuki Mori, Hirokazu Noma | 2017-06-20 |
| 9354408 | Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide | Hirokazu Noma, Masao Tokunari, Kazushige Toriyama, Yutaka Tsukada | 2016-05-31 |
| 9219041 | Electronic package for millimeter wave semiconductor dies | Danny Elad, Noam Kaminski, Evgeny Shumaker, Kazushige Toriyama | 2015-12-22 |
| 9163149 | Implant material | Akira Mochizuki, Yuki Nitta, Tatsuyuki Nakatani | 2015-10-20 |
| 9138507 | Method for manufacturing an implant material | Hiroki Nikawa, Seichiyou Makihira, Yuichi Mine, Yoshinori Abe, Tatsuyuki Nakatani +1 more | 2015-09-22 |
| 8756549 | Integrated circuit chip incorporating embedded thermal radiators for localized, on-demand, heating and a system and method for designing such an integrated circuit chip | Richard S. Graf, Faraydon Pakbaz, Jack R. Smith, Sebastian T. Ventrone | 2014-06-17 |
| 8435287 | Stent and method for fabricating the same | Tatsuyuki Nakatani, Shuzo Yamashita, Ikuo Komura, Koji Mori | 2013-05-07 |