Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12378711 | Sewing management system | — | 2025-08-05 |
| 9772462 | Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide | Hirokazu Noma, Keishi Okamoto, Masao Tokunari, Kazushige Toriyama | 2017-09-26 |
| 9354408 | Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide | Hirokazu Noma, Keishi Okamoto, Masao Tokunari, Kazushige Toriyama | 2016-05-31 |
| 8971678 | Spacer resin pattern helping to reduce optical coupling loss in optical waveguide for light-emitting element or light-receiving element on semiconductor | Daiju Nakano, Masao Tokunari, Kazushige Toriyama | 2015-03-03 |
| 8446734 | Circuit board and mounting structure | Katsura Hayashi, Kimihiro Yamanaka, Masaharu Shirai, Isamu Kirikihira | 2013-05-21 |
| 8284557 | Circuit board, mounting structure, and method for manufacturing circuit board | Kimihiro Yamanaka, Kenji Terada | 2012-10-09 |
| 8129623 | Resin film, adhesive sheet, circuit board, and electronic apparatus | Tadashi Nagasawa, Masaharu Shirai, Kenji Kume | 2012-03-06 |
| 8045829 | Optical waveguide member, optical wiring board, optical wiring module and method for manufacturing optical waveguide member and optical wiring board | Katsura Hayashi | 2011-10-25 |
| 6985362 | Printed circuit board and electronic package using same | Hiroyuki Mori, Kimihiro Yamanaka | 2006-01-10 |
| 6667559 | Ball grid array module and method of manufacturing same | Kimihiro Yamanaka | 2003-12-23 |
| 6551697 | Printed circuit board, method of making same, and photomask for use in the method | Shinji Yamada | 2003-04-22 |
| 6427898 | Solder bump forming method and apparatus | Yohji Maeda | 2002-08-06 |
| 6378201 | Method for making a printed circuit board | Shuhei Tsuchida | 2002-04-30 |
| 6273328 | Solder bump forming method and apparatus | Yohji Maeda | 2001-08-14 |
| 5956843 | Multilayer printed wiring board and method of making same | Shogo Mizumoto | 1999-09-28 |
| 5883335 | Electrical connection substrate having a through hole for connecting a chip to an opposite surface of the substrate | Shogo Mizumoto | 1999-03-16 |
| 5878942 | Soldering method and soldering apparatus | Yasushi Kodama, Shuhei Tsuchita, Yasumitsu Orii, Hideo Ohkuma | 1999-03-09 |
| 5784781 | Manufacturing process for organic chip carrier | Masaharu Shirai, Kenji Terada, Shuhei Tsuchita | 1998-07-28 |
| 5776662 | Method for fabricating a chip carrier with migration barrier, and resulating chip carrier | Masaharu Shirai | 1998-07-07 |
| 5662987 | Multilayer printed wiring board and method of making same | Shogo Mizumoto | 1997-09-02 |
| 5488200 | Interconnect structure with replaced semiconductor chips | — | 1996-01-30 |
| 5470796 | Electronic package with lead wire connections and method of making same | Yasukazu Kobayakawa, Yoji Maeda, Shuhei Tsuchita | 1995-11-28 |
| 5451721 | Multilayer printed circuit board and method for fabricating same | Shuhei Tsuchida | 1995-09-19 |
| 5444299 | Electronic package with lead wire connections | Yasukazu Kobayakawa, Yoji Maeda, Shuhei Tsuchita | 1995-08-22 |
| 5355580 | Method for replacing semiconductor chips | — | 1994-10-18 |