Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12408268 | Organic insulator and wiring board | Chie Chikara, Satoshi YOSHIURA, Satoshi Kajita, Kouji Fujikawa | 2025-09-02 |
| 12177971 | Wiring board | Satoshi YOSHIURA | 2024-12-24 |
| 11426970 | Laminated uncured sheet | Satoshi YOSHIURA, Chie Chikara, Satoshi Kajita, Yasuhide Tami | 2022-08-30 |
| 10806031 | Organic insulating body, metal-clad laminate and wiring board | Chie Chikara, Satoshi Kajita | 2020-10-13 |
| 10772198 | Organic insulator, metal-clad laminate and wiring board | Satoshi YOSHIURA, Chie Chikara | 2020-09-08 |
| 9693451 | Wiring board, mounting structure using same, and method of manufacturing wiring board | Katsura Hayashi | 2017-06-27 |
| 8431832 | Circuit board, mounting structure, and method for manufacturing circuit board | Katsura Hayashi | 2013-04-30 |
| 8338717 | Circuit substrate and structure using the same | — | 2012-12-25 |
| 8129623 | Resin film, adhesive sheet, circuit board, and electronic apparatus | Masaharu Shirai, Kenji Kume, Yutaka Tsukada | 2012-03-06 |
| 6663946 | Multi-layer wiring substrate | Takuji Seri, Katsura Hayashi, Kenji Kume, Takahiro Matsunaga, Isao MIYATANI | 2003-12-16 |