Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12130247 | Method of measuring physical properties, method of evaluating member, method of manufacturing electronic component device, method of manufacturing material for electronic component device, and physical property measurement system | — | 2024-10-29 |
| 9772462 | Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide | Keishi Okamoto, Masao Tokunari, Kazushige Toriyama, Yutaka Tsukada | 2017-09-26 |
| 9760002 | Circuit board formation using organic substrates | Hiroyuki Mori, Keishi Okamoto | 2017-09-12 |
| 9698119 | Interfacial alloy layer for improving electromigration (EM) resistance in solder joints | Yasumitsu Orii, Kazushige Toriyama | 2017-07-04 |
| 9684237 | Circuit board formation using organic substrates | Hiroyuki Mori, Keishi Okamoto | 2017-06-20 |
| 9391034 | Interfacial alloy layer for improving electromigration (EM) resistance in solder joints | Yasumitsu Orii, Kazushige Toriyama | 2016-07-12 |
| 9354408 | Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide | Keishi Okamoto, Masao Tokunari, Kazushige Toriyama, Yutaka Tsukada | 2016-05-31 |
| 7484293 | Semiconductor package and manufacturing method therefor | Yoshiyuki Yamaji, Hiroyuki Mori | 2009-02-03 |