Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315775 | Underfill vacuum process | Toyohiro Aoki, Chinami Marushima, Risa Miyazawa, Takashi Hisada | 2025-05-27 |
| 12142603 | Bonding of bridge to multiple semiconductor chips | Takahito Watanabe, Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori | 2024-11-12 |
| 12094825 | Interconnection between chips by bridge chip | Toyohiro Aoki, Takashi Hisada | 2024-09-17 |
| 12087596 | Controlling of height of high-density interconnection structure on substrate | Keishi Okamoto, Hiroyuki Mori | 2024-09-10 |
| 11908723 | Silicon handler with laser-release layers | Qianwen Chen, Risa Miyazawa, Michael P. Belyansky, John U. Knickerbocker, Takashi Hisada | 2024-02-20 |
| 11848272 | Interconnection between chips by bridge chip | Toyohiro Aoki, Takashi Hisada | 2023-12-19 |
| 11735575 | Bonding of bridge to multiple semiconductor chips | Takahito Watanabe, Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori | 2023-08-22 |
| 11637325 | Large capacity solid state battery | Kuniaki Sueoka, Takahito Watanabe | 2023-04-25 |
| 11574848 | Underfill injection for electronic devices | Kuniaki Sueoka | 2023-02-07 |
| 11320419 | Sampling of breath gas | Kuniaki Sueoka, Toru Aihara | 2022-05-03 |
| 11316143 | Stacked device structure | Kuniaki Sueoka | 2022-04-26 |
| 11211638 | Large capacity solid state battery | Kuniaki Sueoka, Takahito Watanabe | 2021-12-28 |
| 11114308 | Controlling of height of high-density interconnection structure on substrate | Keishi Okamoto, Hiroyuki Mori | 2021-09-07 |
| 11069917 | Stacked film battery architecture | Kuniaki Sueoka | 2021-07-20 |
| 11063288 | Stacked film battery architecture | Kuniaki Sueoka | 2021-07-13 |
| 10903526 | Electron device stack structure | Kuniaki Sueoka, Risa Miyazawa | 2021-01-26 |
| 10679912 | Wafer scale testing and initialization of small die chips | Yasuteru Kohda, Seiji Munetoh, Chitra Subramanian, Kuniaki Sueoka | 2020-06-09 |
| 10679916 | Circuit module and manufacturing method thereof | Sayuri Hada, Kuniaki Sueoka | 2020-06-09 |
| 10672638 | Picking up irregular semiconductor chips | Kuniaki Sueoka | 2020-06-02 |
| 10622311 | High-density interconnecting adhesive tape | Hiroyuki Mori, Keishi Okamoto | 2020-04-14 |
| 10593616 | Reduction of stress in via structure | Toyohiro Aoki, Takashi Hisada, Sayuri Hada, Eiji Nakamura, Kuniaki Sueoka | 2020-03-17 |
| 10529665 | High-density interconnecting adhesive tape | Hiroyuki Mori, Keishi Okamoto | 2020-01-07 |
| 10460971 | Multi-chip package assembly | — | 2019-10-29 |
| 10431847 | Stacked film battery architecture | Kuniaki Sueoka | 2019-10-01 |
| 10424510 | Solder fill into high aspect through holes | Toyohiro Aoki, Kuniaki Sueoka, Kazushige Toriyama | 2019-09-24 |