Issued Patents All Time
Showing 25 most recent of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12064817 | Surface-coated cutting tool | Mitsuhiro Abe, Kazuhiro Kawano | 2024-08-20 |
| 11969828 | Prevention of dripping of material for material injection | Toyohiro Aoki, Takashi Hisada | 2024-04-30 |
| 11720801 | Chemical reaction network for estimating concentration of chemical species based on an identified pattern of output chemical species | Toshiyuki Yamane, Koji Masuda | 2023-08-08 |
| 11684988 | Prevention of dripping of material for material injection | Toyohiro Aoki, Takashi Hisada | 2023-06-27 |
| 11660026 | Restoring a wearable biological sensor | Keiji Matsumoto, Takahito Watanabe, Patrick Ruch, Hiroyuki Mori | 2023-05-30 |
| 11329018 | Forming of bump structure | Takashi Hisada, Toyohiro Aoki | 2022-05-10 |
| 11298769 | Prevention of dripping of material for material injection | Toyohiro Aoki, Takashi Hisada | 2022-04-12 |
| 11181704 | Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump | Toyohiro Aoki, Takashi Hisada, Masao Tokunari | 2021-11-23 |
| 11164845 | Resist structure for forming bumps | Toyohiro Aoki, Takashi Hisada, Risa Miyazawa | 2021-11-02 |
| 11112570 | Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump | Toyohiro Aoki, Takashi Hisada, Masao Tokunari | 2021-09-07 |
| 11008983 | EGR gas distributor | Mamoru Yoshioka, Kaisho SO | 2021-05-18 |
| 10991685 | Assembling of chips by stacking with rotation | Takashi Hisada, Toyohiro Aoki | 2021-04-27 |
| 10956806 | Efficient assembly of oligonucleotides for nucleic acid based data storage | Koji Masuda | 2021-03-23 |
| 10930609 | Method of forming a solder bump structure | Toyohiro Aoki, Takashi Hisada | 2021-02-23 |
| 10840202 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori, Yasumitsu Orii | 2020-11-17 |
| 10833035 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori, Yasumitsu Orii | 2020-11-10 |
| 10797011 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori, Yasumitsu Orii | 2020-10-06 |
| 10741514 | Fabrication of solder balls with injection molded solder | Toyohiro Aoki, Takashi Hisada | 2020-08-11 |
| 10692829 | Method of forming a solder bump structure | Toyohiro Aoki, Takashi Hisada | 2020-06-23 |
| 10662970 | Vortex pump | — | 2020-05-26 |
| 10662901 | Vortex pump | — | 2020-05-26 |
| 10615143 | Injection molded solder bumping | Toyohiro Aoki, Takashi Hisada, Kuniaki Sueoka | 2020-04-07 |
| 10615012 | Sputtering apparatus and substrate processing apparatus | Shigenori Ishihara, Hiroyuki Toya, Yasushi Yasumatsu, Toshikazu Nakazawa, Shintaro Suda +2 more | 2020-04-07 |
| 10607956 | Method of forming a solder bump structure | Toyohiro Aoki, Takashi Hisada | 2020-03-31 |
| 10598874 | Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump | Toyohiro Aoki, Takashi Hisada, Masao Tokunari | 2020-03-24 |