Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637325 | Large capacity solid state battery | Akihiro Horibe, Takahito Watanabe | 2023-04-25 |
| 11574848 | Underfill injection for electronic devices | Akihiro Horibe | 2023-02-07 |
| 11320419 | Sampling of breath gas | Akihiro Horibe, Toru Aihara | 2022-05-03 |
| 11316143 | Stacked device structure | Akihiro Horibe | 2022-04-26 |
| 11211638 | Large capacity solid state battery | Akihiro Horibe, Takahito Watanabe | 2021-12-28 |
| 11069917 | Stacked film battery architecture | Akihiro Horibe | 2021-07-20 |
| 11063288 | Stacked film battery architecture | Akihiro Horibe | 2021-07-13 |
| 10903526 | Electron device stack structure | Akihiro Horibe, Risa Miyazawa | 2021-01-26 |
| 10679912 | Wafer scale testing and initialization of small die chips | Akihiro Horibe, Yasuteru Kohda, Seiji Munetoh, Chitra Subramanian | 2020-06-09 |
| 10679916 | Circuit module and manufacturing method thereof | Akihiro Horibe, Sayuri Hada | 2020-06-09 |
| 10672638 | Picking up irregular semiconductor chips | Akihiro Horibe | 2020-06-02 |
| 10615143 | Injection molded solder bumping | Toyohiro Aoki, Takashi Hisada, Eiji Nakamura | 2020-04-07 |
| 10593616 | Reduction of stress in via structure | Toyohiro Aoki, Takashi Hisada, Akihiro Horibe, Sayuri Hada, Eiji Nakamura | 2020-03-17 |
| 10431847 | Stacked film battery architecture | Akihiro Horibe | 2019-10-01 |
| 10424510 | Solder fill into high aspect through holes | Toyohiro Aoki, Akihiro Horibe, Kazushige Toriyama | 2019-09-24 |
| 10388566 | Solder fill into high aspect through holes | Toyohiro Aoki, Akihiro Horibe, Kazushige Toriyama | 2019-08-20 |
| 10388578 | Wafer scale testing and initialization of small die chips | Akihiro Horibe, Yasuteru Kohda, Seiji Munetoh, Chitra Subramanian | 2019-08-20 |
| 10325839 | Reduction of stress in via structure | Toyohiro Aoki, Takashi Hisada, Akihiro Horibe, Sayuri Hada, Eiji Nakamura | 2019-06-18 |
| 10074583 | Circuit module and manufacturing method thereof | Akihiro Horibe, Sayuri Hada | 2018-09-11 |
| 10037967 | Injection molded solder bumping | Toyohiro Aoki, Takashi Hisada, Eiji Nakamura | 2018-07-31 |
| 9466533 | Semiconductor structure including a through electrode, and method for forming the same | Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama | 2016-10-11 |
| 9373545 | Semiconductor structure including a through electrode, and method for forming the same | Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama | 2016-06-21 |
| 9179579 | Sheet having high thermal conductivity and flexibility | Sayuri Hada, Yoichi Taira | 2015-11-03 |
| 8542963 | Method for manufacturing optical coupling element, optical transmission substrate, optical coupling component, coupling method, and optical interconnect system | Shigeru Nakagawa, Hidetoshi Numata, Yoichi Taira | 2013-09-24 |
| 8442362 | Method for manufacturing optical coupling element, optical transmission substrate, optical coupling component, coupling method, and optical interconnect system | Shigeru Nakagawa, Hidetoshi Numata, Yoichi Taira | 2013-05-14 |