Issued Patents All Time
Showing 25 most recent of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354983 | Fine-pitch joining pad structure | Toyohiro Aoki, Koki Nakamura | 2025-07-08 |
| 12315775 | Underfill vacuum process | Toyohiro Aoki, Chinami Marushima, Risa Miyazawa, Akihiro Horibe | 2025-05-27 |
| 12183708 | Double resist structure for electrodeposition bonding | Koki Nakamura, Toyohiro Aoki | 2024-12-31 |
| 12166008 | Injection molded solder head with improved sealing performance | Sayuri Hada, Toyohiro Aoki, Shintaro Yamamichi | 2024-12-10 |
| 12142603 | Bonding of bridge to multiple semiconductor chips | Akihiro Horibe, Takahito Watanabe, Toyohiro Aoki, Hiroyuki Mori | 2024-11-12 |
| 12094825 | Interconnection between chips by bridge chip | Akihiro Horibe, Toyohiro Aoki | 2024-09-17 |
| 11969828 | Prevention of dripping of material for material injection | Toyohiro Aoki, Eiji Nakamura | 2024-04-30 |
| 11908723 | Silicon handler with laser-release layers | Akihiro Horibe, Qianwen Chen, Risa Miyazawa, Michael P. Belyansky, John U. Knickerbocker | 2024-02-20 |
| 11848272 | Interconnection between chips by bridge chip | Akihiro Horibe, Toyohiro Aoki | 2023-12-19 |
| 11735575 | Bonding of bridge to multiple semiconductor chips | Akihiro Horibe, Takahito Watanabe, Toyohiro Aoki, Hiroyuki Mori | 2023-08-22 |
| 11684988 | Prevention of dripping of material for material injection | Toyohiro Aoki, Eiji Nakamura | 2023-06-27 |
| 11329018 | Forming of bump structure | Toyohiro Aoki, Eiji Nakamura | 2022-05-10 |
| 11298769 | Prevention of dripping of material for material injection | Toyohiro Aoki, Eiji Nakamura | 2022-04-12 |
| 11181704 | Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump | Toyohiro Aoki, Eiji Nakamura, Masao Tokunari | 2021-11-23 |
| 11164845 | Resist structure for forming bumps | Eiji Nakamura, Toyohiro Aoki, Risa Miyazawa | 2021-11-02 |
| 11112570 | Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump | Toyohiro Aoki, Eiji Nakamura, Masao Tokunari | 2021-09-07 |
| 10991685 | Assembling of chips by stacking with rotation | Toyohiro Aoki, Eiji Nakamura | 2021-04-27 |
| 10930609 | Method of forming a solder bump structure | Toyohiro Aoki, Eiji Nakamura | 2021-02-23 |
| 10840202 | Method of forming solder bumps | Toyohiro Aoki, Hiroyuki Mori, Eiji Nakamura, Yasumitsu Orii | 2020-11-17 |
| 10833035 | Method of forming solder bumps | Toyohiro Aoki, Hiroyuki Mori, Eiji Nakamura, Yasumitsu Orii | 2020-11-10 |
| 10797011 | Method of forming solder bumps | Toyohiro Aoki, Hiroyuki Mori, Eiji Nakamura, Yasumitsu Orii | 2020-10-06 |
| 10741514 | Fabrication of solder balls with injection molded solder | Toyohiro Aoki, Eiji Nakamura | 2020-08-11 |
| 10692829 | Method of forming a solder bump structure | Toyohiro Aoki, Eiji Nakamura | 2020-06-23 |
| 10613282 | Fluid control structure | Elaine Cyr, Paul F. Fortier, Patrick Jacques, Koji Masuda, Masao Tokunari | 2020-04-07 |
| 10615143 | Injection molded solder bumping | Toyohiro Aoki, Eiji Nakamura, Kuniaki Sueoka | 2020-04-07 |