Issued Patents All Time
Showing 25 most recent of 308 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300615 | Infrared debond damage mitigation by copper fill pattern | Mukta G. Farooq, Qianwen Chen, Shahid Butt, Eric D. Perfecto, Michael P. Belyansky +1 more | 2025-05-13 |
| 12170252 | Electronic substrate stacking | Lei Shan, Daniel J. Friedman, Griselda Bonilla | 2024-12-17 |
| 12014816 | Multi-sensor platform for health monitoring | Bing Dang, Qianwen Chen, Leanna Pancoast | 2024-06-18 |
| 12015003 | High density interconnection and wiring layers, package structures, and integration methods | Mukta G. Farooq, Katsuyuki Sakuma | 2024-06-18 |
| 11973058 | Multiple die assembly | Katsuyuki Sakuma, Mukta G. Farooq | 2024-04-30 |
| 11903734 | Wearable multiplatform sensor | Rajeev Narayanan, Katsuyuki Sakuma, Bucknell C. Webb | 2024-02-20 |
| 11908723 | Silicon handler with laser-release layers | Akihiro Horibe, Qianwen Chen, Risa Miyazawa, Michael P. Belyansky, Takashi Hisada | 2024-02-20 |
| 11876233 | Thin film battery stacking | Bing Dang, Qianwen Chen | 2024-01-16 |
| 11810893 | Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection | William E. Bernier, Bing Dang, Son K. Tran, Mario J. Interrante | 2023-11-07 |
| 11766729 | Molten solder injection head with vacuum filter and differential gauge system | Jae-Woong Nah, Eric P. Lewandowski | 2023-09-26 |
| 11710669 | Precision thin electronics handling integration | Bing Dang, Qianwen Chen, Joshua M. Rubin, Arvind Kumar | 2023-07-25 |
| 11587860 | Method of forming thin die stack assemblies | Bing Dang, Raymond R. Horton, Joana Sofia Branquinho Teresa Maria | 2023-02-21 |
| 11574835 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | Bing Dang, Jeffrey D. Gelorme | 2023-02-07 |
| 11539088 | Ultra-thin microbattery packaging and handling | Bing Dang, Leanna Pancoast, Jae-Woong Nah | 2022-12-27 |
| 11539081 | Miniaturized electronics package with patterned thin film solid state battery | Qianwen Chen, Bing Dang | 2022-12-27 |
| 11539080 | Miniaturized electronics package with patterned thin film solid state battery | Qianwen Chen, Bing Dang | 2022-12-27 |
| 11522243 | Hermetic packaging of a micro-battery device | Qianwen Chen, Jae-Woong Nah, Bing Dang, Leanna Pancoast | 2022-12-06 |
| 11424152 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia K. Tsang | 2022-08-23 |
| 11411272 | Simplified hermetic packaging of a micro-battery | Paul S. Andry, Bing Dang, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more | 2022-08-09 |
| 11362382 | Simplified hermetic packaging of a micro-battery | Paul S. Andry, Bing Dang, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more | 2022-06-14 |
| 11348833 | IR assisted fan-out wafer level packaging using silicon handler | Bing Dang, Jeffrey D. Gelorme | 2022-05-31 |
| 11315902 | High bandwidth multichip module | — | 2022-04-26 |
| 11307147 | Accurate colorimetric based test strip reader system | Minhua Lu, Vince Siu, Russell A. Budd, Evan G. Colgan | 2022-04-19 |
| 11268867 | Strain gauge structure for a sensor | Minhua Lu, Katsuyuki Sakuma | 2022-03-08 |
| 11222862 | High speed handling of ultra-small chips by selective laser bonding and debonding | Qianwen Chen, Bing Dang, Russell A. Budd, Bo Wen, Li-Wen Hung +1 more | 2022-01-11 |