| 12300615 |
Infrared debond damage mitigation by copper fill pattern |
Mukta G. Farooq, Qianwen Chen, Shahid Butt, Eric D. Perfecto, Michael P. Belyansky +1 more |
2025-05-13 |
|
| 12170252 |
Electronic substrate stacking |
Lei Shan, Daniel J. Friedman, Griselda Bonilla |
2024-12-17 |
$110,801,000 |
| 12014816 |
Multi-sensor platform for health monitoring |
Bing Dang, Qianwen Chen, Leanna Pancoast |
2024-06-18 |
$16,708,000 |
| 12015003 |
High density interconnection and wiring layers, package structures, and integration methods |
Mukta G. Farooq, Katsuyuki Sakuma |
2024-06-18 |
$16,708,000 |
| 11973058 |
Multiple die assembly |
Katsuyuki Sakuma, Mukta G. Farooq |
2024-04-30 |
$14,003,000 |
| 11903734 |
Wearable multiplatform sensor |
Rajeev Narayanan, Katsuyuki Sakuma, Bucknell C. Webb |
2024-02-20 |
$7,691,000 |
| 11908723 |
Silicon handler with laser-release layers |
Akihiro Horibe, Qianwen Chen, Risa Miyazawa, Michael P. Belyansky, Takashi Hisada |
2024-02-20 |
$7,691,000 |
| 11876233 |
Thin film battery stacking |
Bing Dang, Qianwen Chen |
2024-01-16 |
$9,068,000 |
| 11810893 |
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection |
William E. Bernier, Bing Dang, Son K. Tran, Mario J. Interrante |
2023-11-07 |
$6,695,000 |
| 11766729 |
Molten solder injection head with vacuum filter and differential gauge system |
Jae-Woong Nah, Eric P. Lewandowski |
2023-09-26 |
$8,116,000 |
| 11710669 |
Precision thin electronics handling integration |
Bing Dang, Qianwen Chen, Joshua M. Rubin, Arvind Kumar |
2023-07-25 |
$11,323,000 |
| 11587860 |
Method of forming thin die stack assemblies |
Bing Dang, Raymond R. Horton, Joana Sofia Branquinho Teresa Maria |
2023-02-21 |
$5,683,000 |
| 11574835 |
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding |
Bing Dang, Jeffrey D. Gelorme |
2023-02-07 |
$6,435,000 |
| 11539088 |
Ultra-thin microbattery packaging and handling |
Bing Dang, Leanna Pancoast, Jae-Woong Nah |
2022-12-27 |
$9,721,000 |
| 11539081 |
Miniaturized electronics package with patterned thin film solid state battery |
Qianwen Chen, Bing Dang |
2022-12-27 |
$9,721,000 |
| 11539080 |
Miniaturized electronics package with patterned thin film solid state battery |
Qianwen Chen, Bing Dang |
2022-12-27 |
$9,721,000 |
| 11522243 |
Hermetic packaging of a micro-battery device |
Qianwen Chen, Jae-Woong Nah, Bing Dang, Leanna Pancoast |
2022-12-06 |
$6,201,000 |
| 11424152 |
Handler bonding and debonding for semiconductor dies |
Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia K. Tsang |
2022-08-23 |
$8,523,000 |
| 11411272 |
Simplified hermetic packaging of a micro-battery |
Paul S. Andry, Bing Dang, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more |
2022-08-09 |
$6,406,000 |
| 11362382 |
Simplified hermetic packaging of a micro-battery |
Paul S. Andry, Bing Dang, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more |
2022-06-14 |
$8,092,000 |
| 11348833 |
IR assisted fan-out wafer level packaging using silicon handler |
Bing Dang, Jeffrey D. Gelorme |
2022-05-31 |
$8,769,000 |
| 11315902 |
High bandwidth multichip module |
— |
2022-04-26 |
$5,083,000 |
| 11307147 |
Accurate colorimetric based test strip reader system |
Minhua Lu, Vince Siu, Russell A. Budd, Evan G. Colgan |
2022-04-19 |
$6,872,000 |
| 11268867 |
Strain gauge structure for a sensor |
Minhua Lu, Katsuyuki Sakuma |
2022-03-08 |
$4,244,000 |
| 11222862 |
High speed handling of ultra-small chips by selective laser bonding and debonding |
Qianwen Chen, Bing Dang, Russell A. Budd, Bo Wen, Li-Wen Hung +1 more |
2022-01-11 |
$4,843,000 |
