Issued Patents All Time
Showing 1–25 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107065 | Uniform chip gaps via injection-molded solder pillars | Eric P. Lewandowski, Dongbing Shao | 2024-10-01 |
| 11990437 | System and method for forming solder bumps | Eric P. Lewandowski, Jeng-Bang Yau, Peter J. Sorce | 2024-05-21 |
| 11766729 | Molten solder injection head with vacuum filter and differential gauge system | John U. Knickerbocker, Eric P. Lewandowski | 2023-09-26 |
| 11749605 | Hybrid under-bump metallization component | Eric P. Lewandowski, Adinath S. Narasgond | 2023-09-05 |
| 11651973 | Method and apparatus of processor wafer bonding for wafer-scale integrated supercomputer | Evan G. Colgan, Robert P. Kuder, II, James L. Speidell, Bucknell C. Webb | 2023-05-16 |
| 11541472 | Ultrasonic-assisted solder transfer | Stephen L. Buchwalter, Peter A. Gruber, Paul A. Lauro, Da-Yuan Shih | 2023-01-03 |
| 11539088 | Ultra-thin microbattery packaging and handling | Bing Dang, Leanna Pancoast, John U. Knickerbocker | 2022-12-27 |
| 11522243 | Hermetic packaging of a micro-battery device | Qianwen Chen, Bing Dang, Leanna Pancoast, John U. Knickerbocker | 2022-12-06 |
| 11411272 | Simplified hermetic packaging of a micro-battery | Paul S. Andry, Bing Dang, John U. Knickerbocker, Yang Liu, Adinath S. Narasgond +1 more | 2022-08-09 |
| 11362382 | Simplified hermetic packaging of a micro-battery | Paul S. Andry, Bing Dang, John U. Knickerbocker, Yang Liu, Adinath S. Narasgond +1 more | 2022-06-14 |
| 11288587 | Modular, frequency-flexible, superconducting quantum processor architecture | Hanhee Paik, Paul S. Andry, Martin O. Sandberg | 2022-03-29 |
| 11270966 | Combination polyimide decal with a rigid mold | Stephen L. Buchwalter, Peter A. Gruber, Paul A. Lauro, Da-Yuan Shih | 2022-03-08 |
| 11222862 | High speed handling of ultra-small chips by selective laser bonding and debonding | Qianwen Chen, Bing Dang, Russell A. Budd, Bo Wen, Li-Wen Hung +1 more | 2022-01-11 |
| 11201138 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2021-12-14 |
| 11195773 | Flip chip assembly of quantum computing devices | Hanhee Paik, Jerry M. Chow | 2021-12-07 |
| 11183725 | Low-profile battery construct with engineered interfaces | Paul S. Andry, Paul A. Lauro, Adinath S. Narasgond, Robert J. Polastre, Bucknell C. Webb | 2021-11-23 |
| 11165010 | Cold-welded flip chip interconnect structure | Eric P. Lewandowski, Nicholas Torleiv Bronn | 2021-11-02 |
| 11158781 | Permanent wafer handlers with through silicon vias for thermalization and qubit modification | Li-Wen Hung, Eric P. Lewandowski, Adinath S. Narasgond | 2021-10-26 |
| 11110534 | Continuous solder transfer to substrates | Stephen L. Buchwalter, Peter A. Gruber, Da-Yuan Shih, Paul A. Lauro | 2021-09-07 |
| 11043690 | Sandwich-parallel micro-battery | Paul S. Andry, Eric P. Lewandowski, Bucknell C. Webb, Adinath S. Narasgond, Bo Wen | 2021-06-22 |
| 10964925 | Hermetial via seal for thin film battery | Bing Dang, Qianwen Chen, Yu Luo, John U. Knickerbocker, Kai Liu +4 more | 2021-03-30 |
| 10937735 | Hybrid under-bump metallization component | Eric P. Lewandowski, Adinath S. Narasgond | 2021-03-02 |
| 10879202 | System and method for forming solder bumps | Eric P. Lewandowski, Jeng-Bang Yau, Peter J. Sorce | 2020-12-29 |
| 10766086 | Injection-molded solder (IMS) tool assembly and method of use thereof | Claudius Feger, Bonnie L Glick | 2020-09-08 |
| 10740667 | Temperature triggered switch | Li-Wen Hung | 2020-08-11 |