Issued Patents All Time
Showing 26–50 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692831 | Stud bumps for post-measurement qubit frequency modification | Nicholas Torleiv Bronn, Jared Barney Hertzberg, Eric P. Lewandowski | 2020-06-23 |
| 10692795 | Flip chip assembly of quantum computing devices | Hanhee Paik, Jerry M. Chow | 2020-06-23 |
| 10679931 | Ball grid array and land grid array assemblies fabricated using temporary resist | Charles L. Reynolds, Katsuyuki Sakuma | 2020-06-09 |
| 10658267 | Metal cored solder decal structure and process | Peter A. Gruber | 2020-05-19 |
| 10581037 | Low-profile battery construct with engineered interfaces | Paul S. Andry, Paul A. Lauro, Adinath S. Narasgond, Robert J. Polastre, Bucknell C. Webb | 2020-03-03 |
| 10546836 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2020-01-28 |
| 10535592 | Method for forming solder bumps using sacrificial layer | Eric P. Lewandowski, Peter J. Sorce | 2020-01-14 |
| 10490525 | High speed handling of ultra-small chips by selective laser bonding and debonding | Qianwen Chen, Bing Dang, Russell A. Budd, Bo Wen, Li-Wen Hung +1 more | 2019-11-26 |
| 10393962 | Optimized stand-offs and mechanical stops for precise three dimensional self-alignment | Tymon Barwicz, Yves Martin | 2019-08-27 |
| 10383572 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Shriya Kumar | 2019-08-20 |
| 10350713 | No clean flux composition and methods for use thereof | Victor Alvarez, Pierre Y. Beaulieu, Kang-Wook Lee, Lavanya Turlapati | 2019-07-16 |
| 10258279 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Shriya Kumar | 2019-04-16 |
| 10249559 | Ball grid array and land grid array assemblies fabricated using temporary resist | Charles L. Reynolds, Katsuyuki Sakuma | 2019-04-02 |
| 10147694 | Direct injection molded solder process for forming solder bumps on wafers | Bing Dang, Michael A. Gaynes, Paul A. Lauro | 2018-12-04 |
| 10130302 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Shriya Kumar | 2018-11-20 |
| 10079375 | Dual seal microbattery and method of making | Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Jeffrey D. Gelorme, Adinath S. Narasgond, Bucknell C. Webb | 2018-09-18 |
| 10014274 | Optimized solder pads for microelectronic components | Tymon Barwicz, Yves Martin | 2018-07-03 |
| 9972556 | Metal cored solder decal structure and process | Peter A. Gruber | 2018-05-15 |
| 9953908 | Method for forming solder bumps using sacrificial layer | Eric P. Lewandowski, Peter J. Sorce | 2018-04-24 |
| 9897627 | Test probe substrate | Bing Dang, John U. Knickerbocker, Robert E. Trzcinski, Cornelia K. Tsang | 2018-02-20 |
| 9875985 | Flip-chip bonder with induction coils and a heating element | Sébastien S. Quesnel, Katsuyuki Sakuma | 2018-01-23 |
| 9861313 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Shriya Kumar | 2018-01-09 |
| 9851379 | Test probe substrate | Bing Dang, John U. Knickerbocker, Robert E. Trzcinski, Cornelia K. Tsang | 2017-12-26 |
| 9820395 | Low cost hermetic micro-electronics | Bing Dang, John U. Knickerbocker, Minhua Lu, Robert J. Polastre | 2017-11-14 |
| 9808874 | Flux composition and techniques for use thereof | Kang-Wook Lee, Nathalie Normand, Valerie Oberson | 2017-11-07 |