Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11388821 | Thin film capacitors for core and adjacent build up layers | Charles L. Arvin, Brian W. Quinlan, Jean Audet, Francesco Preda | 2022-07-12 |
| 10892249 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Thomas Weiss | 2021-01-12 |
| 10840214 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Thomas Weiss | 2020-11-17 |
| 10813215 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Jean Audet, Edmund Blackshear, Masahiro Fukui, Kenji Terada, Tomoyuki Yamada | 2020-10-20 |
| 10806030 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Jean Audet, Edmund Blackshear, Masahiro Fukui, Kenji Terada, Tomoyuki Yamada | 2020-10-13 |
| 10756031 | Decoupling capacitor stiffener | Charles L. Arvin, Franklin M. Baez, Brian W. Quinlan, Krishna R. Tunga, Thomas Weiss | 2020-08-25 |
| 10687420 | Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance | Jean Audet, Edmund Blackshear, Masahiro Fukui, Kenji Terada, Tomoyuki Yamada | 2020-06-16 |
| 10679931 | Ball grid array and land grid array assemblies fabricated using temporary resist | Jae-Woong Nah, Katsuyuki Sakuma | 2020-06-09 |
| 10660209 | Thin film capacitors for core and adjacent build up layers | Charles L. Arvin, Brian W. Quinlan, Jean Audet, Francesco Preda | 2020-05-19 |
| 10622299 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Brian W. Quinlan, Brian R. Sundlof | 2020-04-14 |
| 10515929 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Thomas Weiss | 2019-12-24 |
| 10431563 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Mark W. Kapfhammer, Brian W. Quinlan, Thomas Weiss | 2019-10-01 |
| 10249559 | Ball grid array and land grid array assemblies fabricated using temporary resist | Jae-Woong Nah, Katsuyuki Sakuma | 2019-04-02 |
| 10224274 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Brian W. Quinlan, Brian R. Sundlof | 2019-03-05 |
| 10224273 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Brian W. Quinlan, Brian R. Sundlof | 2019-03-05 |
| 9899313 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Brian W. Quinlan, Brian R. Sundlof | 2018-02-20 |
| 9263378 | Ball grid array and land grid array assemblies fabricated using temporary resist | Jae-Woong Nah, Katsuyuki Sakuma | 2016-02-16 |
| 8680670 | Multi-chip module system with removable socketed modules | Jon A. Casey, John L. Colbert, Paul M. Harvey, Mark K. Hoffmeyer | 2014-03-25 |
| 7932342 | Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system | Steven E. Molis, William E. Sablinski, Jiali Wu | 2011-04-26 |
| 7808099 | Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method | Randall J. Bertrand, Mark S. Chace, David L. Gardell, George J. Lawson, Yvonne Morris +1 more | 2010-10-05 |
| 6016947 | Non-destructive low melt test for off-composition solder | Timothy W. Donahue, Ellyn M. Ingalls, Chon Cheong Lei, Wai Mon Ma, Horatio Quinones +1 more | 2000-01-25 |
| 5796169 | Structurally reinforced ball grid array semiconductor package and systems | Robert Charles Dockerty, Ronald Maurice Fraga, Ciro Neal Ramirez, Sudipta K. Ray, Gordon J. Robbins | 1998-08-18 |