Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784160 | Asymmetric die bonding | Katsuyuki Sakuma, Shidong Li, Griselda Bonilla | 2023-10-10 |
| 11756911 | Metal pad modification | Ekta Misra | 2023-09-12 |
| 11744981 | Internet of things (IoT) real-time response to defined symptoms | Mahmoud Amin, Lawrence A. Clevenger, Zhenxing Bi, Leigh Anne H. Clevenger | 2023-09-05 |
| 11545444 | Mitigating cooldown peeling stress during chip package assembly | Mukta G. Farooq, Katsuyuki Sakuma, Hilton T. Toy | 2023-01-03 |
| 11302651 | Laminated stiffener to control the warpage of electronic chip carriers | Kamal K. Sikka, Hilton T. Toy, Thomas Weiss, Shidong Li, Sushumna Iruvanti | 2022-04-12 |
| 11302205 | Language learning and speech enhancement through natural language processing | Mahmoud Amin, Zhenxing Bi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny +1 more | 2022-04-12 |
| 11282773 | Enlarged conductive pad structures for enhanced chip bond assembly yield | Thomas Weiss, Charles L. Arvin, Bhupender Singh, Brian W. Quinlan | 2022-03-22 |
| 11239183 | Mitigating thermal-mechanical strain and warpage of an organic laminate substrate | Tuhin Sinha, Brian W. Quinlan, Charles L. Arvin, Steven P. Ostrander, Thomas Weiss | 2022-02-01 |
| 11210968 | Behavior-based interactive educational sessions | Lawrence A. Clevenger, Stefania Axo, Leigh Anne H. Clevenger, Mahmoud Amin, Bryan Gury +4 more | 2021-12-28 |
| 11185658 | Internet of things (IOT) real-time response to defined symptoms | Mahmoud Amin, Lawrence A. Clevenger, Zhenxing Bi, Leigh Anne H. Clevenger | 2021-11-30 |
| 10985129 | Mitigating cracking within integrated circuit (IC) device carrier | Thomas E. Lombardi, Steve Ostrander, Thomas A. Wassick | 2021-04-20 |
| 10950573 | Lead-free column interconnect | Charles L. Arvin, Clement Fortin, Christopher D. Muzzy, Thomas Weiss | 2021-03-16 |
| 10916154 | Language learning and speech enhancement through natural language processing | Mahmoud Amin, Zhenxing Bi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny +1 more | 2021-02-09 |
| 10832987 | Managing thermal warpage of a laminate | Charles L. Arvin, Marcus E. Interrante, Thomas E. Lombardi, Hilton T. Toy, Thomas Weiss | 2020-11-10 |
| 10777482 | Multipart lid for a semiconductor package with multiple components | Charles L. Arvin, Steven P. Ostrander | 2020-09-15 |
| 10770385 | Connected plane stiffener within integrated circuit chip carrier | Anson J. Call, Brian W. Quinlan | 2020-09-08 |
| 10756031 | Decoupling capacitor stiffener | Charles L. Arvin, Franklin M. Baez, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2020-08-25 |
| 10665524 | Electronic package cover having underside rib | Kamal K. Sikka | 2020-05-26 |
| 10636746 | Method of forming an electronic package | Kamal K. Sikka, Hilton T. Toy, Thomas Weiss, Shidong Li, Sushumna Iruvanti | 2020-04-28 |
| 10622319 | Final passivation for wafer level warpage and ULK stress reduction | Ekta Misra | 2020-04-14 |
| 10622275 | Electronic package cover having underside rib | Kamal K. Sikka | 2020-04-14 |
| 10593639 | Metal pad modification | Ekta Misra | 2020-03-17 |
| 10541211 | Control warpage in a semiconductor chip package | Tuhin Sinha | 2020-01-21 |
| 10426400 | Optimized individual sleep patterns | Mahmoud Amin, Zhenxing Bi, Lawrence A. Clevenger, Leigh Anne H. Clevenger | 2019-10-01 |
| 10420502 | Optimized individual sleep patterns | Mahmoud Amin, Zhenxing Bi, Lawrence A. Clevenger, Leigh Anne H. Clevenger | 2019-09-24 |