Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183702 | Electronic package with varying interconnects | Kamal K. Sikka, Charles L. Arvin, Piyas Bal Chowdhury, Alfred Grill, Steven L. Wright | 2024-12-31 |
| 11694992 | Near tier decoupling capacitors | Charles L. Arvin, Bhupender Singh, Joseph C. Sorbello, Joseph Jacobi, Shidong Li +1 more | 2023-07-04 |
| 11228124 | Connecting a component to a substrate by adhesion to an oxidized solder surface | Mark K. Hoffmeyer, Steven P. Ostrander, Thomas Weiss | 2022-01-18 |
| 11152226 | Structure with controlled capillary coverage | Kevin Drummond, Steve Ostrander, Stephanie Allard, Catherine Dufort | 2021-10-19 |
| 10985129 | Mitigating cracking within integrated circuit (IC) device carrier | Steve Ostrander, Krishna R. Tunga, Thomas A. Wassick | 2021-04-20 |
| 10832987 | Managing thermal warpage of a laminate | Charles L. Arvin, Marcus E. Interrante, Hilton T. Toy, Krishna R. Tunga, Thomas Weiss | 2020-11-10 |
| 10750615 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Marie-Claude Paquet +5 more | 2020-08-18 |
| 10368441 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Marie-Claude Paquet +5 more | 2019-07-30 |
| 10014273 | Fixture to constrain laminate and method of assembly | Donald A. Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran | 2018-07-03 |
| 9974179 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Marie-Claude Paquet +5 more | 2018-05-15 |
| 9798088 | Barrier structures for underfill blockout regions | Jeffrey P. Gambino, Robert K. Leidy, Wolfgang Sauter, Christopher D. Muzzy, Eric Turcotte | 2017-10-24 |
| 9673177 | Selectively soluble standoffs for chip joining | Benjamin V. Fasano, Mark W. Kapfhammer, David J. Lewison, Thomas Weiss | 2017-06-06 |
| 9627784 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Marie-Claude Paquet +5 more | 2017-04-18 |
| 9543253 | Method for shaping a laminate substrate | Edmund Blackshear, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng | 2017-01-10 |
| 9455234 | Fixture to constrain laminate and method of assembly | Donald A. Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran | 2016-09-27 |
| 9433105 | Method of fabricating printed circuit boards | Richard S. Graf, Sudipta K. Ray, David J. West | 2016-08-30 |
| 9293439 | Electronic module assembly with patterned adhesive array | Edmund Blackshear, Elaine Cyr, Benjamin V. Fasano, Paul F. Fortier, Marcus E. Interrante +4 more | 2016-03-22 |
| 9093563 | Electronic module assembly with patterned adhesive array | Edmund Blackshear, Elaine Cyr, Benjamin V. Fasano, Paul F. Fortier, Marcus E. Interrante +4 more | 2015-07-28 |
| 9059240 | Fixture for shaping a laminate substrate | Edmund Blackshear, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng | 2015-06-16 |
| 9048245 | Method for shaping a laminate substrate | Edmund Blackshear, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng | 2015-06-02 |
| 8759151 | Fixture to constrain laminate and method of assembly | Donald A. Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran | 2014-06-24 |
| 8492910 | Underfill method and chip package | Michael A. Gaynes, Rajneesh Kumar, Steve Ostrander | 2013-07-23 |
| 8367543 | Structure and method to improve current-carrying capabilities of C4 joints | Mukta G. Farooq, Jasvir Singh Jaspal, William Francis Landers, Hai P. Longworth, H. Bernhard Pogge +1 more | 2013-02-05 |
| 8304290 | Overcoming laminate warpage and misalignment in flip-chip packages | Richard S. Graf, Sudipta K. Ray, David J. West | 2012-11-06 |
| 8188597 | Fixture to constrain laminate and method of assembly | Donald A. Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran | 2012-05-29 |