| 12183702 |
Electronic package with varying interconnects |
Kamal K. Sikka, Charles L. Arvin, Piyas Bal Chowdhury, Alfred Grill, Steven L. Wright |
2024-12-31 |
$22,533,000 |
| 11694992 |
Near tier decoupling capacitors |
Charles L. Arvin, Bhupender Singh, Joseph C. Sorbello, Joseph Jacobi, Shidong Li +1 more |
2023-07-04 |
|
| 11228124 |
Connecting a component to a substrate by adhesion to an oxidized solder surface |
Mark K. Hoffmeyer, Steven P. Ostrander, Thomas Weiss |
2022-01-18 |
$5,274,000 |
| 11152226 |
Structure with controlled capillary coverage |
Kevin Drummond, Steve Ostrander, Stephanie Allard, Catherine Dufort |
2021-10-19 |
$2,168,000 |
| 10985129 |
Mitigating cracking within integrated circuit (IC) device carrier |
Steve Ostrander, Krishna R. Tunga, Thomas A. Wassick |
2021-04-20 |
$5,008,000 |
| 10832987 |
Managing thermal warpage of a laminate |
Charles L. Arvin, Marcus E. Interrante, Hilton T. Toy, Krishna R. Tunga, Thomas Weiss |
2020-11-10 |
$848,000 |
| 10750615 |
Method and apparatus for strain relieving surface mount attached connectors |
Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Marie-Claude Paquet +5 more |
2020-08-18 |
$3,155,000 |
| 10368441 |
Method and apparatus for strain relieving surface mount attached connectors |
Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Marie-Claude Paquet +5 more |
2019-07-30 |
$4,347,000 |
| 10014273 |
Fixture to constrain laminate and method of assembly |
Donald A. Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran |
2018-07-03 |
$3,207,000 |
| 9974179 |
Method and apparatus for strain relieving surface mount attached connectors |
Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Marie-Claude Paquet +5 more |
2018-05-15 |
$2,944,000 |
| 9798088 |
Barrier structures for underfill blockout regions |
Jeffrey P. Gambino, Robert K. Leidy, Wolfgang Sauter, Christopher D. Muzzy, Eric Turcotte |
2017-10-24 |
$9,961,000 |
| 9673177 |
Selectively soluble standoffs for chip joining |
Benjamin V. Fasano, Mark W. Kapfhammer, David J. Lewison, Thomas Weiss |
2017-06-06 |
$2,871,000 |
| 9627784 |
Method and apparatus for strain relieving surface mount attached connectors |
Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Marie-Claude Paquet +5 more |
2017-04-18 |
$1,813,000 |
| 9543253 |
Method for shaping a laminate substrate |
Edmund Blackshear, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng |
2017-01-10 |
$8,696,000 |
| 9455234 |
Fixture to constrain laminate and method of assembly |
Donald A. Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran |
2016-09-27 |
$4,099,000 |
| 9433105 |
Method of fabricating printed circuit boards |
Richard S. Graf, Sudipta K. Ray, David J. West |
2016-08-30 |
$3,867,000 |
| 9293439 |
Electronic module assembly with patterned adhesive array |
Edmund Blackshear, Elaine Cyr, Benjamin V. Fasano, Paul F. Fortier, Marcus E. Interrante +4 more |
2016-03-22 |
$709,000 |
| 9093563 |
Electronic module assembly with patterned adhesive array |
Edmund Blackshear, Elaine Cyr, Benjamin V. Fasano, Paul F. Fortier, Marcus E. Interrante +4 more |
2015-07-28 |
$3,451,000 |
| 9059240 |
Fixture for shaping a laminate substrate |
Edmund Blackshear, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng |
2015-06-16 |
$2,098,000 |
| 9048245 |
Method for shaping a laminate substrate |
Edmund Blackshear, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng |
2015-06-02 |
$4,815,000 |
| 8759151 |
Fixture to constrain laminate and method of assembly |
Donald A. Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran |
2014-06-24 |
$6,231,000 |
| 8492910 |
Underfill method and chip package |
Michael A. Gaynes, Rajneesh Kumar, Steve Ostrander |
2013-07-23 |
$2,085,000 |
| 8367543 |
Structure and method to improve current-carrying capabilities of C4 joints |
Mukta G. Farooq, Jasvir Singh Jaspal, William Francis Landers, Hai P. Longworth, H. Bernhard Pogge +1 more |
2013-02-05 |
$5,221,000 |
| 8304290 |
Overcoming laminate warpage and misalignment in flip-chip packages |
Richard S. Graf, Sudipta K. Ray, David J. West |
2012-11-06 |
$8,916,000 |
| 8188597 |
Fixture to constrain laminate and method of assembly |
Donald A. Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran |
2012-05-29 |
$10,419,000 |
