Issued Patents All Time
Showing 25 most recent of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027442 | Thermal interface material, an integrated circuit formed therewith, and a method of application thereof | Navid Kazem, Keyton D. Feller, Hing Jii Mea, Dylan S. Shah, Allyssa Kerr +1 more | 2024-07-02 |
| 11574835 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | Bing Dang, John U. Knickerbocker | 2023-02-07 |
| 11424152 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2022-08-23 |
| 11348833 | IR assisted fan-out wafer level packaging using silicon handler | Bing Dang, John U. Knickerbocker | 2022-05-31 |
| 11172837 | Forming wearable stacked strain gauge sensor for monitoring | Katsuyuki Sakuma, Marlon Agno | 2021-11-16 |
| 11121005 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2021-09-14 |
| 11094407 | Electronics miniaturization platform for medication verification and tracking | John U. Knickerbocker, Li-Wen Hung, Bing Dang, Katsuyuki Sakuma, Rajeev Narayanan +1 more | 2021-08-17 |
| 10998217 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | Bing Dang, John U. Knickerbocker | 2021-05-04 |
| 10750615 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi, Marie-Claude Paquet +5 more | 2020-08-18 |
| 10679887 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-06-09 |
| 10658182 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2020-05-19 |
| 10651036 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2020-05-12 |
| 10651134 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Li-Wen Hung, John U. Knickerbocker | 2020-05-12 |
| 10607963 | Chip package for two-phase cooling and assembly process thereof | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Michael A. Gaynes, Gerard McVicker +4 more | 2020-03-31 |
| 10586726 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-03-10 |
| 10573538 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-02-25 |
| 10522383 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | Bing Dang, John U. Knickerbocker | 2019-12-31 |
| 10522406 | IR assisted fan-out wafer level packaging using silicon handler | Bing Dang, John U. Knickerbocker | 2019-12-31 |
| 10483215 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Li-Wen Hung, John U. Knickerbocker | 2019-11-19 |
| 10395929 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2019-08-27 |
| 10368441 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi, Marie-Claude Paquet +5 more | 2019-07-30 |
| 10325785 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2019-06-18 |
| 10224219 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2019-03-05 |
| 10217637 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2019-02-26 |
| 10174229 | Adhesive resins for wafer bonding | Robert David Allen, Li-Wen Hung, Ratnam Sooriyakumaran, Linda Karin Sundberg | 2019-01-08 |