Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10750615 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2020-08-18 |
| 10368441 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2019-07-30 |
| 10338325 | Nanofiller in an optical interface | Barnim Alexander Janta-Polczynski, Tymon Barwicz, Elaine Cyr, Nicolas Boyer, Richard Langlois +1 more | 2019-07-02 |
| 9974179 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2018-05-15 |
| 9698072 | Low-stress dual underfill packaging | Peter J. Brofman, Julien Sylvestre | 2017-07-04 |
| 9627784 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2017-04-18 |
| 9373559 | Low-stress dual underfill packaging | Peter J. Brofman, Julien Sylvestre | 2016-06-21 |
| 8796049 | Underfill adhesion measurements at a microscopic scale | Maxime Cadotte, Julien Sylvestre | 2014-08-05 |
| 8786059 | Passivation layer surface topography modifications for improved integrity in packaged assemblies | Alexandre Blander, Jon A. Casey, Timothy H. Daubenspeck, Ian D. Melville, Jennifer V. Muncy | 2014-07-22 |
| 8580673 | Underfill flow guide structures and method of using same | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2013-11-12 |
| 8409980 | Underfill flow guide structures and method of using same | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2013-04-02 |
| 8299581 | Passivation layer extension to chip edge | Timothy H. Daubenspeck, Ekta Misra, Francis Santerre, Wolfgang Sauter | 2012-10-30 |
| 8236615 | Passivation layer surface topography modifications for improved integrity in packaged assemblies | Alexandre Blander, Jon A. Casey, Timothy H. Daubenspeck, Ian D. Melville, Jennifer V. Muncy | 2012-08-07 |
| 8159067 | Underfill flow guide structures | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2012-04-17 |
| 6988882 | Transfer molding of integrated circuit packages | Marie-France Boyaud, Catherine Dufort, Real Tetreault | 2006-01-24 |
| 6956296 | Transfer molding of integrated circuit packages | Marie-France Boyaud, Catherine Dufort, Real Tetreault | 2005-10-18 |
| 6656773 | Transfer molding of integrated circuit packages | Marie-France Boyaud, Catherine Dufort, Real Tetreault | 2003-12-02 |