Issued Patents All Time
Showing 1–25 of 584 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12310139 | Semiconductor devices with single-photon avalanche diodes and isolation structures | David T. Price, Marc Sulfridge, Richard A. Mauritzson, Michael Gerard KEYES, Ryan Rettmann +1 more | 2025-05-20 |
| 12211865 | Edge seals for semiconductor packages | Kyle Thomas, David T. Price, Rusty WINZENREAD, Bruce Greenwood | 2025-01-28 |
| 12034025 | Semiconductor devices with single-photon avalanche diodes and isolation structures | David T. Price, Marc Sulfridge, Richard A. Mauritzson, Michael Gerard KEYES, Ryan Rettmann +1 more | 2024-07-09 |
| 11973006 | Self-aligned contact openings for backside through substrate vias | Swarnal Borthakur | 2024-04-30 |
| 11961859 | Edge seals for semiconductor packages | Kyle Thomas, David T. Price, Rusty WINZENREAD, Bruce Greenwood | 2024-04-16 |
| 11756977 | Backside illumination image sensors | Rick C. Jerome, David T. Price | 2023-09-12 |
| 11670655 | Edge seals for semiconductor packages | Kyle Thomas, David T. Price, Rusty WINZENREAD, Bruce Greenwood | 2023-06-06 |
| 11195969 | Method of forming a metal silicide transparent conductive electrode | Derrick Liu, Daniel S. Vanslette | 2021-12-07 |
| 11120941 | Methods of forming capacitors | Bruce Greenwood, Angel Rodriguez | 2021-09-14 |
| 11075148 | Stacked transistor assembly with dual middle mounting clips | David T. Price, Jeffery A. Neuls, Dean E. Probst, Santosh Menon, Peter A. Burke +1 more | 2021-07-27 |
| 11056610 | Method of forming a metal silicide transparent conductive electrode | Derrick Liu, Daniel S. Vanslette | 2021-07-06 |
| 10978416 | Dual bond pad structure for photonics | Richard S. Graf, Robert K. Leidy, Jeffrey C. Maling | 2021-04-13 |
| 10978415 | Semiconductor package having magnetic interconnects and related methods | Thomas F. Long | 2021-04-13 |
| 10964840 | Photodiode structures | John J. Ellis-Monaghan, Mark D. Jaffe, Kirk D. Peterson | 2021-03-30 |
| 10900923 | Moisture detection and ingression monitoring systems and methods of manufacture | Fen Chen, Carole D. Graas, Wen Liu, Prakash Periasamy | 2021-01-26 |
| 10896992 | Photodiode structures | John J. Ellis-Monaghan, Mark D. Jaffe, Kirk D. Peterson | 2021-01-19 |
| 10833038 | Dual bond pad structure for photonics | Richard S. Graf, Robert K. Leidy, Jeffrey C. Maling | 2020-11-10 |
| 10790253 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Christopher D. Muzzy, Wolfgang Sauter | 2020-09-29 |
| 10790190 | Backside contact to a final substrate | Mark D. Jaffe, Steven M. Shank, Anthony K. Stamper | 2020-09-29 |
| 10748864 | Bonded semiconductor package and related methods | Thomas F. Long, Charles Alvah Hill | 2020-08-18 |
| 10712498 | Shielding structures between optical waveguides | John J. Ellis-Monaghan, Mark D. Jaffe, Kirk D. Peterson, Jed H. Rankin | 2020-07-14 |
| 10629482 | Backside contact to a final substrate | Mark D. Jaffe, Steven M. Shank, Anthony K. Stamper | 2020-04-21 |
| 10622506 | Photodiode structures | John J. Ellis-Monaghan, Mark D. Jaffe, Kirk D. Peterson | 2020-04-14 |
| 10615302 | Photodiode structures | John J. Ellis-Monaghan, Mark D. Jaffe, Kirk D. Peterson | 2020-04-07 |
| 10615137 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Charles F. Musante, Christopher D. Muzzy, Wolfgang Sauter | 2020-04-07 |