Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784137 | Package assembly for thin wafer shipping and method of use | Damyon L. Corbin | 2020-09-22 |
| 10622235 | Package assembly for thin wafer shipping and method of use | Damyon L. Corbin | 2020-04-14 |
| 10615137 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2020-04-07 |
| 10468280 | Package assembly for thin wafer shipping and method of use | Damyon L. Corbin | 2019-11-05 |
| 10204877 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2019-02-12 |
| 10163673 | Dual adhesive bonding with perforated wafer | Jeffrey P. Gambino, Kenneth F. McAvey, Jr., Anthony K. Stamper | 2018-12-25 |
| 10090180 | Package assembly for thin wafer shipping and method of use | Damyon L. Corbin | 2018-10-02 |
| 9953940 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2018-04-24 |
| 9716010 | Handle wafer | Jeffrey P. Gambino, Kenneth F. McAvey, Jr., Bruce W. Porth, Anthony K. Stamper, Timothy D. Sullivan | 2017-07-25 |
| 9607929 | Tsv wafer with improved fracture strength | James W. Adkisson, Yoba Amoah, Jeffrey P. Gambino, Christine A. Leggett, Max L. Lifson +2 more | 2017-03-28 |
| 9543175 | Package assembly for thin wafer shipping and method of use | Damyon L. Corbin | 2017-01-10 |
| 9312205 | Methods of forming a TSV wafer with improved fracture strength | James W. Adkisson, Yoba Amoah, Jeffrey P. Gambino, Christine A. Leggett, Max L. Lifson +2 more | 2016-04-12 |
| 9165831 | Dice before grind with backside metal | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-10-20 |
| 9059111 | Reliable back-side-metal structure | Robert D. Edwards, Jeffrey P. Gambino, Ping-Chuan Wang | 2015-06-16 |
| 8912091 | Backside metal ground plane with improved metal adhesion and design structures | Jay Burnham, Damyon L. Corbin, George A. Dunbar, III, Jeffrey P. Gambino, John C. Hall +2 more | 2014-12-16 |
| 8878326 | Imager microlens structure having interfacial region for adhesion of protective layer | Edward C. Cooney, III, Jeffrey P. Gambino, Robert K. Leidy, John G. Twombly | 2014-11-04 |
| 8778737 | Flattened substrate surface for substrate bonding | Edward C. Cooney, III, James S. Dunn, Dale W. Martin, BethAnn Rainey, Leathen Shi +2 more | 2014-07-15 |
| 8742560 | Anti-reflection structures for CMOS image sensors | James W. Adkisson, John J. Ellis-Monaghan, Jeffrey P. Gambino | 2014-06-03 |
| 8716771 | Anti-reflection structures for CMOS image sensors | James W. Adkisson, John J. Ellis-Monaghan, Jeffrey P. Gambino | 2014-05-06 |
| 8476099 | Methods for improved adhesion of protective layers of imager microlens structures by forming an interfacial region | Edward C. Cooney, III, Jeffrey P. Gambino, Robert K. Leidy, John G. Twombly | 2013-07-02 |
| 8409904 | Methods for forming anti-reflection structures for CMOS image sensors | James W. Adkisson, John J. Ellis-Monaghan, Jeffrey P. Gambino | 2013-04-02 |
| 8409899 | Delamination and crack resistant image sensor structures and methods | Jeffrey P. Gambino, Mark D. Jaffe, Robert K. Leidy, Richard J. Rassel | 2013-04-02 |
| 8298853 | CMOS pixel sensor cells with poly spacer transfer gates and methods of manufacture | James W. Adkisson, John J. Ellis-Monaghan, Rajendran Krishnasamy, Solomon Mulugeta, Richard J. Rassel | 2012-10-30 |
| 8233070 | Variable dynamic range pixel sensor cell, design structure and method | John J. Ellis-Monaghan, Mark D. Jaffe | 2012-07-31 |
| 8138534 | Anti-reflection structures for CMOS image sensors | James W. Adkisson, John J. Ellis-Monaghan, Jeffrey P. Gambino | 2012-03-20 |