Issued Patents All Time
Showing 1–25 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10224276 | Integrated circuit including wire structure, related method and design structure | Jeffrey P. Gambino, Zhong-Xiang He, Robert K. Leidy | 2019-03-05 |
| 10163697 | Method for forming BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion | Felix P. Anderson, Michael S. Dusablon, David C. Mosher | 2018-12-25 |
| 10141274 | Semiconductor chip with anti-reverse engineering function | Fen Chen, Jonathan M. Pratt, Jason P. Ritter, Patrick S. Spinney, Anna Tilley | 2018-11-27 |
| 10056306 | Test structure for monitoring interface delamination | Gary L. Milo, Thomas Warren Weeks, Jr., Patrick S. Spinney, John C. S. Hall, Brian P. Conchieri +2 more | 2018-08-21 |
| 9893023 | Semiconductor chip with anti-reverse engineering function | Fen Chen, Jonathan M. Pratt, Jason P. Ritter, Patrick S. Spinney, Anna Tilley | 2018-02-13 |
| 9831122 | Integrated circuit including wire structure, related method and design structure | Jeffrey P. Gambino, Zhong-Xiang He, Robert K. Leidy | 2017-11-28 |
| 9728509 | Laser scribe structures for a wafer | Anthony K. Stamper, Laurie M. Krywanczyk | 2017-08-08 |
| 9711464 | Semiconductor chip with anti-reverse engineering function | Fen Chen, Jonathan M. Pratt, Jason P. Ritter, Patrick S. Spinney, Anna Tilley | 2017-07-18 |
| 9673091 | Structure for BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion | Felix P. Anderson, Michael S. Dusablon, David C. Mosher | 2017-06-06 |
| 9577023 | Metal wires of a stacked inductor | Dinh Dang, David A. DeMuynck, Sarah A. McTaggart, Gary L. Milo, Melissa J. Roma +2 more | 2017-02-21 |
| 9355936 | Flattened substrate surface for substrate bonding | James S. Dunn, Dale W. Martin, Charles S. Musante, BethAnn Rainey Lawrence, Leathen Shi +2 more | 2016-05-31 |
| 9196592 | Methods of managing metal density in dicing channel and related integrated circuit structures | Jeffrey P. Gambino, Richard S. Graf, Gary L. Milo | 2015-11-24 |
| 8969195 | Methods of manufacturing semiconductor devices and a semiconductor structure | Felix P. Anderson, Steven P. Barkyoumb, Thomas L. McDevitt, William J. Murphy, David C. Strippe | 2015-03-03 |
| 8878326 | Imager microlens structure having interfacial region for adhesion of protective layer | Jeffrey P. Gambino, Robert K. Leidy, Charles F. Musante, John G. Twombly | 2014-11-04 |
| 8822993 | Integrated circuit including sensor structure, related method and design structure | Jeffrey P. Gambino, Zhong-Xiang He, Tom C. Lee | 2014-09-02 |
| 8803284 | Thick on-chip high-performance wiring structures | Jeffrey P. Gambino, Zhong-Xiang He, Tom C. Lee, Xiao Hu Liu | 2014-08-12 |
| 8791778 | Vertical integrated circuit switches, design structure and methods of fabricating same | Felix P. Anderson, Thomas L. McDevitt, Anthony K. Stamper | 2014-07-29 |
| 8778737 | Flattened substrate surface for substrate bonding | James S. Dunn, Dale W. Martin, Charles F. Musante, BethAnn Rainey, Leathen Shi +2 more | 2014-07-15 |
| 8765595 | Thick on-chip high-performance wiring structures | Jeffrey P. Gambino, Zhong-Xiang He, Tom C. Lee, Xiao Hu Liu | 2014-07-01 |
| 8643190 | Through substrate via including variable sidewall profile | Peter J. Lindgren, Doreen Jane Ossenkop, Anthony K. Stamper | 2014-02-04 |
| 8604618 | Structure and method for reducing vertical crack propagation | Jeffrey P. Gambino, Zhong-Xiang He, Xiao Hu Liu, Thomas L. McDevitt, Gary L. Milo +1 more | 2013-12-10 |
| 8604898 | Vertical integrated circuit switches, design structure and methods of fabricating same | Felix P. Anderson, Thomas L. McDevitt, Anthony K. Stamper | 2013-12-10 |
| 8575022 | Top corner rounding of damascene wire for insulator crack suppression | Gregory S. Chrisman, Jeffrey P. Gambino, Zhong-Xiang He, Thomas L. McDevitt, Eva A. Shah | 2013-11-05 |
| 8564113 | Electrostatic chucking of an insulator handle substrate | Paul S. Andry, Edmund J. Sprogis, Anthony K. Stamper, Cornelia K. Tsang | 2013-10-22 |
| 8476099 | Methods for improved adhesion of protective layers of imager microlens structures by forming an interfacial region | Jeffrey P. Gambino, Robert K. Leidy, Charles F. Musante, John G. Twombly | 2013-07-02 |