| 9284185 |
Integrated circuit switches, design structure and methods of fabricating the same |
Felix P. Anderson, Anthony K. Stamper, Julio C. Costa, Jonathan Hale Hammond |
2016-03-15 |
$907,000 |
| 9275951 |
Curvilinear wiring structure to reduce areas of high field density in an integrated circuit |
Felix P. Anderson, Anthony K. Stamper |
2016-03-01 |
$579,000 |
| 8969195 |
Methods of manufacturing semiconductor devices and a semiconductor structure |
Felix P. Anderson, Steven P. Barkyoumb, Edward C. Cooney, III, William J. Murphy, David C. Strippe |
2015-03-03 |
$3,627,000 |
| 8927411 |
System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme |
Felix P. Anderson, Timothy H. Daubenspeck, Jeffrey P. Gambino, Timothy S. Hayes, Donald R. Letourneau +1 more |
2015-01-06 |
$2,134,000 |
| 8921975 |
System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme |
Felix P. Anderson, Timothy H. Daubenspeck, Jeffrey P. Gambino, Timothy S. Hayes, Donald R. Letourneau +1 more |
2014-12-30 |
$7,309,000 |
| 8878315 |
Horizontal coplanar switches and methods of manufacture |
Felix P. Anderson, Anthony K. Stamper |
2014-11-04 |
$3,955,000 |
| 8791778 |
Vertical integrated circuit switches, design structure and methods of fabricating same |
Felix P. Anderson, Edward C. Cooney, III, Anthony K. Stamper |
2014-07-29 |
$5,690,000 |
| 8637403 |
Locally tailoring chemical mechanical polishing (CMP) polish rate for dielectrics |
Yoba Amoah, Graham M. Bates, Joseph P. Hasselbach, Eva A. Shah |
2014-01-28 |
$3,630,000 |
| 8604898 |
Vertical integrated circuit switches, design structure and methods of fabricating same |
Felix P. Anderson, Edward C. Cooney, III, Anthony K. Stamper |
2013-12-10 |
$5,756,000 |
| 8604618 |
Structure and method for reducing vertical crack propagation |
Edward C. Cooney, III, Jeffrey P. Gambino, Zhong-Xiang He, Xiao Hu Liu, Gary L. Milo +1 more |
2013-12-10 |
$5,756,000 |
| 8586466 |
Electrical fuse with a current shunt |
Tom C. Lee, William J. Murphy |
2013-11-19 |
$3,686,000 |
| 8575022 |
Top corner rounding of damascene wire for insulator crack suppression |
Gregory S. Chrisman, Edward C. Cooney, III, Jeffrey P. Gambino, Zhong-Xiang He, Eva A. Shah |
2013-11-05 |
$5,290,000 |
| 8569091 |
Integrated circuit switches, design structure and methods of fabricating the same |
Felix P. Anderson, Anthony K. Stamper |
2013-10-29 |
$6,299,000 |
| 8535966 |
Horizontal coplanar switches and methods of manufacture |
Felix P. Anderson, Anthony K. Stamper |
2013-09-17 |
$4,204,000 |
| 8530970 |
Curvilinear wiring structure to reduce areas of high field density in an integrated circuit |
Felix P. Anderson, Anthony K. Stamper |
2013-09-10 |
$8,933,000 |
| 8349728 |
Method of fabricating copper damascene and dual damascene interconnect wiring |
Jeffrey P. Gambino, William R. Hill, Kenneth E. McAvey, Jr., Anthony K. Stamper, Arthur C. Winslow +1 more |
2013-01-08 |
$4,312,000 |
| 8293634 |
Structures and methods for improving solder bump connections in semiconductor devices |
Felix P. Anderson, William J. Cote, Daniel C. Edelstein, Anthony K. Stamper |
2012-10-23 |
$6,526,000 |
| 8137791 |
Fuse and pad stress relief |
Felix P. Anderson, Jeffrey P. Gambino, Anthony K. Stamper |
2012-03-20 |
$2,170,000 |
| 8129844 |
Method of forming a metal silicide layer, devices incorporating metal silicide layers and design structures for the devices |
Felix P. Anderson, Zhong-Xiang He, Eric J. White |
2012-03-06 |
$5,131,000 |
| 8106513 |
Copper damascene and dual damascene interconnect wiring |
Jeffrey P. Gambino, William R. Hill, Kenneth E. McAvey, Jr., Anthony K. Stamper, Arthur C. Winslow +1 more |
2012-01-31 |
$4,013,000 |
| 8088690 |
CMP method |
Graham M. Bates, Eva A. Shah, Matthew T. Tiersch, Eric J. White |
2012-01-03 |
$8,800,000 |
| 8026606 |
Interconnect layers without electromigration |
Stephen E. Luce, Anthony K. Stamper |
2011-09-27 |
$6,526,000 |
| 7879716 |
Metal seed layer deposition |
Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Keith E. Downes, William J. Murphy |
2011-02-01 |
$3,711,000 |
| 7709905 |
Dual damascene wiring and method |
Anthony K. Stamper |
2010-05-04 |
$4,679,000 |
| 7678683 |
Method of fabricating copper damascene and dual damascene interconnect wiring |
Jeffrey P. Gambino, William R. Hill, Kenneth E. McAvey, Jr., Anthony K. Stamper, Arthur C. Winslow +1 more |
2010-03-16 |
$7,988,000 |
