Issued Patents All Time
Showing 25 most recent of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9284185 | Integrated circuit switches, design structure and methods of fabricating the same | Felix P. Anderson, Anthony K. Stamper, Julio C. Costa, Jonathan Hale Hammond | 2016-03-15 |
| 9275951 | Curvilinear wiring structure to reduce areas of high field density in an integrated circuit | Felix P. Anderson, Anthony K. Stamper | 2016-03-01 |
| 8969195 | Methods of manufacturing semiconductor devices and a semiconductor structure | Felix P. Anderson, Steven P. Barkyoumb, Edward C. Cooney, III, William J. Murphy, David C. Strippe | 2015-03-03 |
| 8927411 | System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme | Felix P. Anderson, Timothy H. Daubenspeck, Jeffrey P. Gambino, Timothy S. Hayes, Donald R. Letourneau +1 more | 2015-01-06 |
| 8921975 | System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme | Felix P. Anderson, Timothy H. Daubenspeck, Jeffrey P. Gambino, Timothy S. Hayes, Donald R. Letourneau +1 more | 2014-12-30 |
| 8878315 | Horizontal coplanar switches and methods of manufacture | Felix P. Anderson, Anthony K. Stamper | 2014-11-04 |
| 8791778 | Vertical integrated circuit switches, design structure and methods of fabricating same | Felix P. Anderson, Edward C. Cooney, III, Anthony K. Stamper | 2014-07-29 |
| 8637403 | Locally tailoring chemical mechanical polishing (CMP) polish rate for dielectrics | Yoba Amoah, Graham M. Bates, Joseph P. Hasselbach, Eva A. Shah | 2014-01-28 |
| 8604898 | Vertical integrated circuit switches, design structure and methods of fabricating same | Felix P. Anderson, Edward C. Cooney, III, Anthony K. Stamper | 2013-12-10 |
| 8604618 | Structure and method for reducing vertical crack propagation | Edward C. Cooney, III, Jeffrey P. Gambino, Zhong-Xiang He, Xiao Hu Liu, Gary L. Milo +1 more | 2013-12-10 |
| 8586466 | Electrical fuse with a current shunt | Tom C. Lee, William J. Murphy | 2013-11-19 |
| 8575022 | Top corner rounding of damascene wire for insulator crack suppression | Gregory S. Chrisman, Edward C. Cooney, III, Jeffrey P. Gambino, Zhong-Xiang He, Eva A. Shah | 2013-11-05 |
| 8569091 | Integrated circuit switches, design structure and methods of fabricating the same | Felix P. Anderson, Anthony K. Stamper | 2013-10-29 |
| 8535966 | Horizontal coplanar switches and methods of manufacture | Felix P. Anderson, Anthony K. Stamper | 2013-09-17 |
| 8530970 | Curvilinear wiring structure to reduce areas of high field density in an integrated circuit | Felix P. Anderson, Anthony K. Stamper | 2013-09-10 |
| 8349728 | Method of fabricating copper damascene and dual damascene interconnect wiring | Jeffrey P. Gambino, William R. Hill, Kenneth E. McAvey, Jr., Anthony K. Stamper, Arthur C. Winslow +1 more | 2013-01-08 |
| 8293634 | Structures and methods for improving solder bump connections in semiconductor devices | Felix P. Anderson, William J. Cote, Daniel C. Edelstein, Anthony K. Stamper | 2012-10-23 |
| 8137791 | Fuse and pad stress relief | Felix P. Anderson, Jeffrey P. Gambino, Anthony K. Stamper | 2012-03-20 |
| 8129844 | Method of forming a metal silicide layer, devices incorporating metal silicide layers and design structures for the devices | Felix P. Anderson, Zhong-Xiang He, Eric J. White | 2012-03-06 |
| 8106513 | Copper damascene and dual damascene interconnect wiring | Jeffrey P. Gambino, William R. Hill, Kenneth E. McAvey, Jr., Anthony K. Stamper, Arthur C. Winslow +1 more | 2012-01-31 |
| 8088690 | CMP method | Graham M. Bates, Eva A. Shah, Matthew T. Tiersch, Eric J. White | 2012-01-03 |
| 8026606 | Interconnect layers without electromigration | Stephen E. Luce, Anthony K. Stamper | 2011-09-27 |
| 7879716 | Metal seed layer deposition | Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Keith E. Downes, William J. Murphy | 2011-02-01 |
| 7709905 | Dual damascene wiring and method | Anthony K. Stamper | 2010-05-04 |
| 7678683 | Method of fabricating copper damascene and dual damascene interconnect wiring | Jeffrey P. Gambino, William R. Hill, Kenneth E. McAvey, Jr., Anthony K. Stamper, Arthur C. Winslow +1 more | 2010-03-16 |