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Dual-damascene process to fabricate thick wire structure |
Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper |
2015-10-27 |
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Dual-damascene process to fabricate thick wire structure |
Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper |
2014-06-17 |
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Process for single and multiple level metal-insulator-metal integration with a single mask |
Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +1 more |
2013-05-07 |
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Dual-damascene process to fabricate thick wire structure |
Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper |
2012-08-07 |
| 8227849 |
Method and structure for creation of a metal insulator metal capacitor |
Ebenezer E. Eshun, Ronald J. Bolam, Douglas D. Coolbaugh, Natalie B. Feilchenfeld, Zhong-Xiang He |
2012-07-24 |
| 8207568 |
Process for single and multiple level metal-insulator-metal integration with a single mask |
Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +1 more |
2012-06-26 |
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Method of integration of a MIM capacitor with a lower plate of metal gate material formed on an STI region or a silicide region formed in or on the surface of a doped well with a high K dielectric material |
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2011-03-29 |
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Method of fabricating a precision buried resistor |
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2011-03-22 |
| 7879716 |
Metal seed layer deposition |
Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Thomas L. McDevitt, William J. Murphy |
2011-02-01 |
| 7728372 |
Method and structure for creation of a metal insulator metal capacitor |
Ebenezer E. Eshun, Ronald J. Bolam, Douglas D. Coolbaugh, Natalie B. Feilchenfeld, Zhong-Xiang He |
2010-06-01 |
| 7602068 |
Dual-damascene process to fabricate thick wire structure |
Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper |
2009-10-13 |
| 7361950 |
Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectric |
Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +2 more |
2008-04-22 |
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Metal seed layer deposition |
Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Thomas L. McDevitt, William J. Murphy |
2007-06-26 |