KD

Keith E. Downes

IBM: 11 patents #9,995 of 70,183Top 15%
IM International Machines: 1 patents #1 of 34Top 3%
GU Globalfoundries U.S.: 1 patents #22 of 211Top 15%
Overall (All Time): #383,907 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9171778 Dual-damascene process to fabricate thick wire structure Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper 2015-10-27
8753950 Dual-damascene process to fabricate thick wire structure Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper 2014-06-17
8435864 Process for single and multiple level metal-insulator-metal integration with a single mask Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +1 more 2013-05-07
8236663 Dual-damascene process to fabricate thick wire structure Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper 2012-08-07
8227849 Method and structure for creation of a metal insulator metal capacitor Ebenezer E. Eshun, Ronald J. Bolam, Douglas D. Coolbaugh, Natalie B. Feilchenfeld, Zhong-Xiang He 2012-07-24
8207568 Process for single and multiple level metal-insulator-metal integration with a single mask Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +1 more 2012-06-26
7915134 Method of integration of a MIM capacitor with a lower plate of metal gate material formed on an STI region or a silicide region formed in or on the surface of a doped well with a high K dielectric material Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +2 more 2011-03-29
7910450 Method of fabricating a precision buried resistor Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, John E. Florkey, Heidi L. Greer +3 more 2011-03-22
7879716 Metal seed layer deposition Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Thomas L. McDevitt, William J. Murphy 2011-02-01
7728372 Method and structure for creation of a metal insulator metal capacitor Ebenezer E. Eshun, Ronald J. Bolam, Douglas D. Coolbaugh, Natalie B. Feilchenfeld, Zhong-Xiang He 2010-06-01
7602068 Dual-damascene process to fabricate thick wire structure Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper 2009-10-13
7361950 Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectric Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +2 more 2008-04-22
7235487 Metal seed layer deposition Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Thomas L. McDevitt, William J. Murphy 2007-06-26