Keith E. Downes — 13 Patents at IBM

Keith E. Downes has been granted 13 US patents while listed as an inventor at IBM. The first was granted in 2007 and the most recent in October 2015. Keith E. Downes ranks #362,438 of 4,157,543 US inventors in our database (top 8.7%). Patent records list Keith E. Downes in Stowe, VT, US.

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9171778	Dual-damascene process to fabricate thick wire structure	Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper	2015-10-27
8753950	Dual-damascene process to fabricate thick wire structure	Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper	2014-06-17	$4,121,000
8435864	Process for single and multiple level metal-insulator-metal integration with a single mask	Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +1 more	2013-05-07	$10,737,000
8236663	Dual-damascene process to fabricate thick wire structure	Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper	2012-08-07	$7,112,000
8227849	Method and structure for creation of a metal insulator metal capacitor	Ebenezer E. Eshun, Ronald J. Bolam, Douglas D. Coolbaugh, Natalie B. Feilchenfeld, Zhong-Xiang He	2012-07-24	$4,383,000
8207568	Process for single and multiple level metal-insulator-metal integration with a single mask	Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +1 more	2012-06-26	$15,244,000
7915134	Method of integration of a MIM capacitor with a lower plate of metal gate material formed on an STI region or a silicide region formed in or on the surface of a doped well with a high K dielectric material	Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +2 more	2011-03-29	$5,031,000
7910450	Method of fabricating a precision buried resistor	Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, John E. Florkey, Heidi L. Greer +3 more	2011-03-22	$5,211,000
7879716	Metal seed layer deposition	Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Thomas L. McDevitt, William J. Murphy	2011-02-01	$3,711,000
7728372	Method and structure for creation of a metal insulator metal capacitor	Ebenezer E. Eshun, Ronald J. Bolam, Douglas D. Coolbaugh, Natalie B. Feilchenfeld, Zhong-Xiang He	2010-06-01	$6,263,000
7602068	Dual-damascene process to fabricate thick wire structure	Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper	2009-10-13	$16,422,000
7361950	Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectric	Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +2 more	2008-04-22	$8,943,000
7235487	Metal seed layer deposition	Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Thomas L. McDevitt, William J. Murphy	2007-06-26	$10,209,000

Keith E. Downes — 13 Patents

Issued Patents All Time

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