Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9171778 | Dual-damascene process to fabricate thick wire structure | Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper | 2015-10-27 |
| 8753950 | Dual-damascene process to fabricate thick wire structure | Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper | 2014-06-17 |
| 8435864 | Process for single and multiple level metal-insulator-metal integration with a single mask | Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +1 more | 2013-05-07 |
| 8236663 | Dual-damascene process to fabricate thick wire structure | Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper | 2012-08-07 |
| 8227849 | Method and structure for creation of a metal insulator metal capacitor | Ebenezer E. Eshun, Ronald J. Bolam, Douglas D. Coolbaugh, Natalie B. Feilchenfeld, Zhong-Xiang He | 2012-07-24 |
| 8207568 | Process for single and multiple level metal-insulator-metal integration with a single mask | Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +1 more | 2012-06-26 |
| 7915134 | Method of integration of a MIM capacitor with a lower plate of metal gate material formed on an STI region or a silicide region formed in or on the surface of a doped well with a high K dielectric material | Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +2 more | 2011-03-29 |
| 7910450 | Method of fabricating a precision buried resistor | Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, John E. Florkey, Heidi L. Greer +3 more | 2011-03-22 |
| 7879716 | Metal seed layer deposition | Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Thomas L. McDevitt, William J. Murphy | 2011-02-01 |
| 7728372 | Method and structure for creation of a metal insulator metal capacitor | Ebenezer E. Eshun, Ronald J. Bolam, Douglas D. Coolbaugh, Natalie B. Feilchenfeld, Zhong-Xiang He | 2010-06-01 |
| 7602068 | Dual-damascene process to fabricate thick wire structure | Douglas D. Coolbaugh, Peter J. Lindgren, Anthony K. Stamper | 2009-10-13 |
| 7361950 | Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectric | Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel +2 more | 2008-04-22 |
| 7235487 | Metal seed layer deposition | Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Thomas L. McDevitt, William J. Murphy | 2007-06-26 |