| 10068802 |
Threshold mismatch and IDDQ reduction using split carbon co-implantation |
Himadri Sekhar Pal, Amitabh Jain |
2018-09-04 |
$18,628,000 |
| 9431533 |
Method to enable higher carbon co-implants to improve device mismatch without degrading leakage |
— |
2016-08-30 |
$12,944,000 |
| 9406769 |
Silicide formation due to improved SiGe faceting |
Shashank S. Ekbote, Kwan-Yong Lim, Youn Sung Choi |
2016-08-02 |
$22,242,000 |
| 9224653 |
Integrated circuit and method of forming the integrated circuit with improved logic transistor performance and SRAM transistor yield |
Himadri Sekhar Pal, Shashank S. Ekbote |
2015-12-29 |
$12,350,000 |
| 9202883 |
Silicide formation due to improved SiGe faceting |
Shashank S. Ekbote, Kwan-Yong Lim, Youn Sung Choi |
2015-12-01 |
$15,969,000 |
| 9093298 |
Silicide formation due to improved SiGe faceting |
Shashank S. Ekbote, Kwan-Yong Lim, Youn Sung Choi |
2015-07-28 |
$10,990,000 |
| 9076670 |
Integrated circuit and method of forming the integrated circuit with improved logic transistor performance and SRAM transistor yield |
Himadri Sekhar Pal, Shashank S. Ekbote |
2015-07-07 |
$9,588,000 |
| 8881379 |
Method of making heat sink for integrated circuit devices |
Douglas D. Coolbaugh, Terence B. Hook, Robert M. Rassel, Edmund J. Sprogis, Anthony K. Stamper +1 more |
2014-11-11 |
$15,773,000 |
| 8791545 |
Interconnect structures and design structures for a radiofrequency integrated circuit |
Timothy J. Dalton, Sarah L. Grunow, Zhong-Xiang He, Anthony K. Stamper |
2014-07-29 |
$5,690,000 |
| 8680618 |
Structure and method for integrating front end SiCr resistors in HiK metal gate technologies |
— |
2014-03-25 |
$5,856,000 |
| 8609505 |
Method of forming MIM capacitor structure in FEOL |
Douglas D. Coolbaugh, Robert M. Rassel, Anthony K. Stamper |
2013-12-17 |
$6,242,000 |
| 8569840 |
Bipolar transistor integrated with metal gate CMOS devices |
Thomas A. Wallner, Daniel Jaeger, Phung T. Nguyen |
2013-10-29 |
$6,299,000 |
| 8487401 |
Methods of fabricating passive element without planarizing and related semiconductor device |
Anil K. Chinthakindi, Timothy J. Dalton, Jeffrey P. Gambino, Anthony K. Stamper, Kunal Vaed |
2013-07-16 |
$5,283,000 |
| 8435864 |
Process for single and multiple level metal-insulator-metal integration with a single mask |
Anil K. Chinthakindi, Douglas D. Coolbaugh, Keith E. Downes, Zhong-Xiang He, Robert M. Rassel +1 more |
2013-05-07 |
$10,737,000 |
| 8390038 |
MIM capacitor and method of making same |
Douglas D. Coolbaugh, Zhong-Xiang He, Robert M. Rassel |
2013-03-05 |
$6,102,000 |
| 8378450 |
Interdigitated vertical parallel capacitor |
Roger A. Booth, Jr., Douglas D. Coolbaugh, Zhong-Xiang He |
2013-02-19 |
$3,959,000 |
| 8298902 |
Interconnect structures, methods for fabricating interconnect structures, and design structures for a radiofrequency integrated circuit |
Timothy J. Dalton, Sarah L. Grunow, Zhong-Xiang He, Anthony K. Stamper |
2012-10-30 |
|
| 8230586 |
Method of cooling a resistor |
Douglas D. Coolbaugh, Terence B. Hook, Robert M. Rassel, Edmund J. Sprogis, Anthony K. Stamper +1 more |
2012-07-31 |
$5,473,000 |
| 8227849 |
Method and structure for creation of a metal insulator metal capacitor |
Ronald J. Bolam, Douglas D. Coolbaugh, Keith E. Downes, Natalie B. Feilchenfeld, Zhong-Xiang He |
2012-07-24 |
$4,383,000 |
| 8207568 |
Process for single and multiple level metal-insulator-metal integration with a single mask |
Anil K. Chinthakindi, Douglas D. Coolbaugh, Keith E. Downes, Zhong-Xiang He, Robert M. Rassel +1 more |
2012-06-26 |
$15,244,000 |
| 8159040 |
Metal gate integration structure and method including metal fuse, anti-fuse and/or resistor |
Douglas D. Coolbaugh, Ephrem G. Gebreselasie, Zhong-Xiang He, Herbert L. Ho, Deok-kee Kim +8 more |
2012-04-17 |
$5,847,000 |
| 8129234 |
Method of forming bipolar transistor integrated with metal gate CMOS devices |
Thomas A. Wallner, Daniel Jaeger, Phung T. Nguyen |
2012-03-06 |
$5,131,000 |
| 8125049 |
MIM capacitor structure in FEOL and related method |
Douglas D. Coolbaugh, Robert M. Rassel, Anthony K. Stamper |
2012-02-28 |
$6,579,000 |
| 8120143 |
Integrated circuit comb capacitor |
Daniel C. Edelstein, Anil K. Chinthakindi, Timothy J. Dalton, Jeffrey P. Gambino, Sarah L. Lane +1 more |
2012-02-21 |
$5,017,000 |
| 8119491 |
Methods of fabricating passive element without planarizing and related semiconductor device |
Anil K. Chinthakindi, Timothy J. Dalton, Jeffrey P. Gambino, Anthony K. Stamper, Kunal Vaed |
2012-02-21 |
$5,017,000 |
