Issued Patents All Time
Showing 1–25 of 175 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319870 | Photovoltaic module with a controllable infrared protection layer | Lawrence A. Clevenger, Maxime Darnon, Rainer Krause, Gerd Pfeiffer, Kevin M. Prettyman +2 more | 2019-06-11 |
| 9472402 | Methods and structures for protecting one area while processing another area on a chip | Deok-kee Kim, Kenneth T. Settlemyer, Jr., Kangguo Cheng, Ramachandra Divakaruni, Carl Radens +4 more | 2016-10-18 |
| 9201041 | Extended gate sensor for pH sensing | Ashish Jagtiani, Ramachandran Muralidhar, Sufi Zafar | 2015-12-01 |
| 9089080 | Corrugated interfaces for multilayered interconnects | Lawrence A. Clevenger, Elbert E. Huang, Sampath Purushothaman, Carl Radens | 2015-07-21 |
| 9059000 | Methods and structures for protecting one area while processing another area on a chip | Deok-kee Kim, Kenneth T. Settlemyer, Jr., Kangguo Cheng, Ramachandra Divakaruni, Carl Radens +4 more | 2015-06-16 |
| 9035465 | Forming semiconductor chip connections | Kangguo Cheng, Mukta G. Farooq, John A. Fitzsimmons, Louis L. Hsu | 2015-05-19 |
| 8828521 | Corrugated interfaces for multilayered interconnects | Lawrence A. Clevenger, Elbert E. Huang, Sampath Purushothaman, Carl Radens | 2014-09-09 |
| 8802497 | Forming semiconductor chip connections | Louis L. Hsu, Kangguo Cheng, Mukta G. Farooq, John A. Fitzsimmons | 2014-08-12 |
| 8791545 | Interconnect structures and design structures for a radiofrequency integrated circuit | Ebenezer E. Eshun, Sarah L. Grunow, Zhong-Xiang He, Anthony K. Stamper | 2014-07-29 |
| 8754400 | Two-dimensional patterning employing self-assembled material | Bruce B. Doris, Ho-Cheol Kim, Carl Radens | 2014-06-17 |
| 8689152 | Double-sided integrated circuit chips | Kerry Bernstein, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke, Stephen E. Luce +1 more | 2014-04-01 |
| 8513769 | Electrical fuses and resistors having sublithographic dimensions | Charles T. Black, Matthew E. Colburn, Daniel C. Edelstein, Wai-Kin Li, Anthony K. Stamper +1 more | 2013-08-20 |
| 8512849 | Corrugated interfaces for multilayered interconnects | Lawrence A. Clevenger, Elbert E. Huang, Sampath Purushothaman, Carl Radens | 2013-08-20 |
| 8486511 | Pattern formation employing self-assembled material | Charles T. Black, Bruce B. Doris, Carl Radens | 2013-07-16 |
| 8486512 | Pattern formation employing self-assembled material | Charles T. Black, Bruce B. Doris, Carl Radens | 2013-07-16 |
| 8487401 | Methods of fabricating passive element without planarizing and related semiconductor device | Anil K. Chinthakindi, Ebenezer E. Eshun, Jeffrey P. Gambino, Anthony K. Stamper, Kunal Vaed | 2013-07-16 |
| 8471306 | Double-sided integrated circuit chips | Kerry Bernstein, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke, Stephen E. Luce +1 more | 2013-06-25 |
| 8421126 | Double-sided integrated circuit chips | Kerry Bernstein, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke, Stephen E. Luce +1 more | 2013-04-16 |
| 8343868 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, John A. Fitzsimmons, Jeffrey P. Gambino +10 more | 2013-01-01 |
| 8304912 | Structure and method for MOSFET gate electrode landing pad | Lawrence A. Clevenger, Louis C. Hsu, Carl Radens, Kwong Hon Wong, Chih-Chao Yang | 2012-11-06 |
| 8298902 | Interconnect structures, methods for fabricating interconnect structures, and design structures for a radiofrequency integrated circuit | Ebenezer E. Eshun, Sarah L. Grunow, Zhong-Xiang He, Anthony K. Stamper | 2012-10-30 |
| 8269291 | Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters | Leena Paivikki Buchwalter, Kevin K. Chan, Christopher V. Jahnes, Jennifer Lund, Kevin Shawn Petraraca +2 more | 2012-09-18 |
| 8236610 | Forming semiconductor chip connections | Louis L. Hsu, Kangguo Cheng, Mukta G. Farooq, John A. Fitzsimmons | 2012-08-07 |
| 8232211 | Methods for self-aligned self-assembled patterning enhancement | Larry Clevenger, Carl Radens | 2012-07-31 |
| 8232190 | Three dimensional vertical E-fuse structures and methods of manufacturing the same | Kerry Bernstein, Jeffrey P. Gambino, Mark D. Jaffe, Stephen E. Luce, Anthony K. Stamper | 2012-07-31 |