Larry Clevenger — 14 Patents at IBM

Larry Clevenger has been granted 14 US patents while listed as an inventor at IBM. The first was granted in 2000 and the most recent in July 2012. Larry Clevenger ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Larry Clevenger in Lagrangeville, NY, US.

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8232211	Methods for self-aligned self-assembled patterning enhancement	Timothy J. Dalton, Carl Radens	2012-07-31	$5,473,000
7906426	Method of controlled low-k via etch for Cu interconnections	Wuping Liu, Johnny Widodo, Teck Jung Tang, Jing Hui Li, Han Wah Ng +1 more	2011-03-15	$6,222,000
7365001	Interconnect structures and methods of making thereof	Chih-Chao Yang, Louis L. Hsu, Keith Kwong Hon Wong, Timothy J. Dalton, Carl Radens	2008-04-29	$12,832,000
7241696	Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer	Timothy J. Dalton, Mark Hoinkis, Steffen K. Kaldor, Kaushik A. Kumar, Douglas C. La Tulipe, Jr. +5 more	2007-07-10
7125792	Dual damascene structure and method	Kaushik A. Kumar, Douglas C. La Tulipe, Jr., Timothy J. Dalton, Andy Cowley, Erdem Kaltalioglu +1 more	2006-10-24
7091612	Dual damascene structure and method	Kaushik A. Kumar, Timothy J. Dalton, Andy Cowley, Douglas C. La Tulipe, Jr., Mark Hoinkis +5 more	2006-08-15
6890815	Reduced cap layer erosion for borderless contacts	Johnathan E. Faltermeier, Jeremy K. Stephens, David M. Dobuzinsky, Munir D. Naeem, Chienfan Yu +3 more	2005-05-10
6784105	Simultaneous native oxide removal and metal neutral deposition method	Chih-Chao Yang, Yun-Yu Wang, Andrew H. Simon, Stephen E. Greco, Kaushik Chanda +3 more	2004-08-31
6661097	Ti liner for copper interconnect with low-k dielectric	Stanley J. Klepeis, Hsiao-Ling Lu, Jeffrey R. Marino, Andrew H. Simon, Yun-Yu Wang +2 more	2003-12-09	$6,520,000
6420216	Fuse processing using dielectric planarization pillars	Louis L. Hsu, Chandrasekhar Narayan, Jeremy K. Stephens, Michael Wise	2002-07-16
6361880	CVD/PVD/CVD/PVD fill process	Roy Iggulden, Rainer Florian Schnabel, Stefan Weber	2002-03-26
6281114	Planarization after metal chemical mechanical polishing in semiconductor wafer fabrication	Chenting Lin, Ranier Florian Schnabel	2001-08-28
6136709	Metal line deposition process	Sven Schmidbauer, Stefan Weber, Peter Weigand, Roy Iggulden	2000-10-24
6057236	CVD/PVD method of filling structures using discontinuous CVD AL liner	Mark Hoinkis, Roy Iggulden, Stefan Weber	2000-05-02	$31,039,000

Larry Clevenger — 14 Patents

Issued Patents All Time

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