Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8232211 | Methods for self-aligned self-assembled patterning enhancement | Timothy J. Dalton, Carl Radens | 2012-07-31 |
| 7906426 | Method of controlled low-k via etch for Cu interconnections | Wuping Liu, Johnny Widodo, Teck Jung Tang, Jing Hui Li, Han Wah Ng +1 more | 2011-03-15 |
| 7365001 | Interconnect structures and methods of making thereof | Chih-Chao Yang, Louis L. Hsu, Keith Kwong Hon Wong, Timothy J. Dalton, Carl Radens | 2008-04-29 |
| 7241696 | Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer | Timothy J. Dalton, Mark Hoinkis, Steffen K. Kaldor, Kaushik A. Kumar, Douglas C. La Tulipe, Jr. +5 more | 2007-07-10 |
| 7125792 | Dual damascene structure and method | Kaushik A. Kumar, Douglas C. La Tulipe, Jr., Timothy J. Dalton, Andy Cowley, Erdem Kaltalioglu +1 more | 2006-10-24 |
| 7091612 | Dual damascene structure and method | Kaushik A. Kumar, Timothy J. Dalton, Andy Cowley, Douglas C. La Tulipe, Jr., Mark Hoinkis +5 more | 2006-08-15 |
| 6890815 | Reduced cap layer erosion for borderless contacts | Johnathan E. Faltermeier, Jeremy K. Stephens, David M. Dobuzinsky, Munir D. Naeem, Chienfan Yu +3 more | 2005-05-10 |
| 6784105 | Simultaneous native oxide removal and metal neutral deposition method | Chih-Chao Yang, Yun-Yu Wang, Andrew H. Simon, Stephen E. Greco, Kaushik Chanda +3 more | 2004-08-31 |
| 6661097 | Ti liner for copper interconnect with low-k dielectric | Stanley J. Klepeis, Hsiao-Ling Lu, Jeffrey R. Marino, Andrew H. Simon, Yun-Yu Wang +2 more | 2003-12-09 |
| 6420216 | Fuse processing using dielectric planarization pillars | Louis L. Hsu, Chandrasekhar Narayan, Jeremy K. Stephens, Michael Wise | 2002-07-16 |
| 6361880 | CVD/PVD/CVD/PVD fill process | Roy Iggulden, Rainer Florian Schnabel, Stefan Weber | 2002-03-26 |
| 6281114 | Planarization after metal chemical mechanical polishing in semiconductor wafer fabrication | Chenting Lin, Ranier Florian Schnabel | 2001-08-28 |
| 6136709 | Metal line deposition process | Sven Schmidbauer, Stefan Weber, Peter Weigand, Roy Iggulden | 2000-10-24 |
| 6057236 | CVD/PVD method of filling structures using discontinuous CVD AL liner | Mark Hoinkis, Roy Iggulden, Stefan Weber | 2000-05-02 |