Issued Patents All Time
Showing 1–25 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12366705 | Photonics optoelectrical system | William Charles, Douglas D. Coolbaugh, Gerald L. Leake | 2025-07-22 |
| 11886014 | Two-stage expanded beam optical coupling | Junwen He, Joris Van Campenhout, Geert Van Steenberge, Jeroen Missinne, Yigit O. Yilmaz +1 more | 2024-01-30 |
| 11841531 | Wafer scale bonded active photonics interposer | Douglas D. Coolbaugh, Gerald L. Leake | 2023-12-12 |
| 11550099 | Photonics optoelectrical system | William Charles, Douglas D. Coolbaugh, Gerald L. Leake | 2023-01-10 |
| 11550173 | Heterogeneous structure on an integrated photonics platform | Douglas D. Coolbaugh, Paul A. Morton, Nicholas G. Usechak | 2023-01-10 |
| 11435523 | Wafer scale bonded active photonics interposer | Douglas D. Coolbaugh, Gerald L. Leake | 2022-09-06 |
| 11029466 | Photonics structure with integrated laser | William Charles, John E. Bowers, Douglas D. Coolbaugh, Daehwan Jung, Jonathan Klamkin +3 more | 2021-06-08 |
| 10976491 | Photonics interposer optoelectronics | Douglas D. Coolbaugh, Michael Robert Watts, Michal Lipson, Keren Bergman, Thomas L. Koch +2 more | 2021-04-13 |
| 10877300 | Heterogeneous structure on an integrated photonics platform | Douglas D. Coolbaugh, Paul A. Morton, Nicholas G. Usechak | 2020-12-29 |
| 10698156 | Wafer scale bonded active photonics interposer | Douglas D. Coolbaugh, Gerald L. Leake | 2020-06-30 |
| 9620481 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Wei Lin, Deepika Priyadarshini, Spyridon Skordas, Tuan A. Vo +1 more | 2017-04-11 |
| 9583628 | Semiconductor device with a low-K spacer and method of forming the same | Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz | 2017-02-28 |
| 9543229 | Combination of TSV and back side wiring in 3D integration | Pooja R. Batra, John W. Golz, Subramanian S. Iyer, Spyridon Skordas, Kevin R. Winstel | 2017-01-10 |
| 9536809 | Combination of TSV and back side wiring in 3D integration | Pooja R. Batra, John W. Golz, Subramanian S. Iyer, Spyridon Skordas, Kevin R. Winstel | 2017-01-03 |
| 9412620 | Three-dimensional integrated circuit device fabrication including wafer scale membrane | Sampath Purushothaman, James Vichiconti | 2016-08-09 |
| 9318375 | Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias | Mark Todhunter Robson | 2016-04-19 |
| 9219129 | Inverted thin channel mosfet with self-aligned expanded source/drain | Bruce B. Doris, Kangguo Cheng, Ali Khakifirooz | 2015-12-22 |
| 9190303 | Reducing wafer bonding misalignment by varying thermal treatment prior to bonding | Wei Lin, Spyridon Skordas, Kevin R. Winstel | 2015-11-17 |
| 9171749 | Handler wafer removal facilitated by the addition of an amorphous carbon layer on the handler wafer | Bing Dang, Sarah H. Knickerbocker, Spyridon Skordas, Cornelia K. Tsang, Kevin R. Winstel | 2015-10-27 |
| 9064937 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Wei Lin, Deepika Priyadarshini, Spyridon Skordas, Tuan A. Vo +1 more | 2015-06-23 |
| 9059039 | Reducing wafer bonding misalignment by varying thermal treatment prior to bonding | Wei Lin, Spyridon Skordas, Kevin R. Winstel | 2015-06-16 |
| 9034701 | Semiconductor device with a low-k spacer and method of forming the same | Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz | 2015-05-19 |
| 9029238 | Advanced handler wafer bonding and debonding | Paul S. Andry, Russell A. Budd, John U. Knickerbocker, Robert E. Trzcinski | 2015-05-12 |
| 8963278 | Three-dimensional integrated circuit device using a wafer scale membrane | Sampath Purushothaman, James Vichiconti | 2015-02-24 |
| 8946007 | Inverted thin channel mosfet with self-aligned expanded source/drain | Bruce B. Doris, Kangguo Cheng, Ali Khakifirooz | 2015-02-03 |