Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11790072 | Paint on micro chip touch screens | Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger +1 more | 2023-10-17 |
| 11355379 | Oxide-bonded wafer pair separation using laser debonding | Mukta G. Farooq, Dale Curtis McHerron | 2022-06-07 |
| 11322361 | Selective etching of silicon wafer | Da Song, Allan Upham, Cornelius Brown Peethala, Kevin R. Winstel | 2022-05-03 |
| 11239167 | Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate | Mukta G. Farooq, Ravi K. Bonam, James J. Kelly | 2022-02-01 |
| 11182722 | Cognitive system for automatic risk assessment, solution identification, and action enablement | Alex Richard Hubbard, Marc A. Bergendahl, Cody J. Murray, Gauri Karve, Lawrence A. Clevenger | 2021-11-23 |
| 11068896 | Granting requests for authorization using data of devices associated with requestors | Lawrence A. Clevenger, Richard C. Johnson | 2021-07-20 |
| 10915620 | Paint on micro chip touch screens | Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger +1 more | 2021-02-09 |
| 10777433 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Wei Lin, Robert R. Young | 2020-09-15 |
| 10681207 | Caller identity verification based on unique multi-device signatures | Richard C. Johnson, Lawrence A. Clevenger | 2020-06-09 |
| 10615139 | Semiconductor device including built-in crack-arresting film structure | Wei Lin, Leathen Shi, Kevin R. Winstel | 2020-04-07 |
| 10404306 | Paint on micro chip touch screens | Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger +1 more | 2019-09-03 |
| 10269760 | Advanced chip to wafer stacking | Wei Lin | 2019-04-23 |
| 10211178 | Semiconductor device including built-in crack-arresting film structure | Wei Lin, Leathen Shi, Kevin R. Winstel | 2019-02-19 |
| 10170447 | Advanced chip to wafer stacking | Wei Lin | 2019-01-01 |
| 10157757 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Wei Lin, Robert R. Young | 2018-12-18 |
| 10134577 | Edge trim processes and resultant structures | Richard F. Indyk, Deepika Priyadarshini, Edmund J. Sprogis, Anthony K. Stamper, Kevin R. Winstel | 2018-11-20 |
| 10056272 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Wei Lin, Robert R. Young | 2018-08-21 |
| 10020279 | Semiconductor device including built-in crack-arresting film structure | Wei Lin, Leathen Shi, Kevin R. Winstel | 2018-07-10 |
| 9922851 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Wei Lin, Robert R. Young | 2018-03-20 |
| 9881896 | Advanced chip to wafer stacking | Wei Lin | 2018-01-30 |
| 9784917 | Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrate | Stephen M. Gates, Joyeeta Nag, Jason S. Orcutt, Jean-Olivier Plouchart | 2017-10-10 |
| 9671215 | Wafer to wafer alignment | Mukta G. Farooq, John A. Fitzsimmons | 2017-06-06 |
| 9640514 | Wafer bonding using boron and nitrogen based bonding stack | Wei Lin, Troy L. Graves-Abe, Donald F. Canaperi, Matthew T. Shoudy, Binglin Miao +2 more | 2017-05-02 |
| 9620481 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Wei Lin, Deepika Priyadarshini, Tuan A. Vo +1 more | 2017-04-11 |
| 9564386 | Semiconductor package with structures for cooling fluid retention | Wei Lin, Son V. Nguyen, Tuan A. Vo | 2017-02-07 |