Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9553054 | Strain detection structures for bonded wafers and chips | Mukta G. Farooq, John A. Fitzsimmons, Erdem Kaltalioglu, Wei Lin, Kevin R. Winstel | 2017-01-24 |
| 9543229 | Combination of TSV and back side wiring in 3D integration | Pooja R. Batra, John W. Golz, Subramanian S. Iyer, Douglas C. La Tulipe, Jr., Kevin R. Winstel | 2017-01-10 |
| 9536809 | Combination of TSV and back side wiring in 3D integration | Pooja R. Batra, John W. Golz, Subramanian S. Iyer, Douglas C. La Tulipe, Jr., Kevin R. Winstel | 2017-01-03 |
| 9536853 | Semiconductor device including built-in crack-arresting film structure | Wei Lin, Leathen Shi, Kevin R. Winstel | 2017-01-03 |
| 9472457 | Manganese oxide hard mask for etching dielectric materials | Wei Lin, Tuan A. Vo | 2016-10-18 |
| 9472710 | Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrate | Stephen M. Gates, Joyeeta Nag, Jason S. Orcutt, Jean-Olivier Plouchart | 2016-10-18 |
| 9466538 | Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding process | Subramanian S. Iyer, Donald F. Canaperi, Shidong Li, Wei Lin | 2016-10-11 |
| 9401303 | Handler wafer removal by use of sacrificial inert layer | Kangguo Cheng, Jonathan E. Faltermeier, Mukta G. Farooq, Wei Lin, Kevin R. Winstel | 2016-07-26 |
| 9378966 | Selective etching of silicon wafer | Brown C. Peethala, Da Song, Allan Upham, Kevin R. Winstel | 2016-06-28 |
| 9263366 | Liquid cooling of semiconductor chips utilizing small scale structures | Wei Lin, Son V. Nguyen, Tuan A. Vo | 2016-02-16 |
| 9214435 | Via structure for three-dimensional circuit integration | Mukta G. Farooq, Troy L. Graves-Abe, Kevin R. Winstel | 2015-12-15 |
| 9190303 | Reducing wafer bonding misalignment by varying thermal treatment prior to bonding | Douglas C. La Tulipe, Jr., Wei Lin, Kevin R. Winstel | 2015-11-17 |
| 9171749 | Handler wafer removal facilitated by the addition of an amorphous carbon layer on the handler wafer | Bing Dang, Sarah H. Knickerbocker, Douglas C. La Tulipe, Jr., Cornelia K. Tsang, Kevin R. Winstel | 2015-10-27 |
| 9142488 | Manganese oxide hard mask for etching dielectric materials | Wei Lin, Tuan A. Vo | 2015-09-22 |
| 9105517 | Wafer to wafer alignment by LED/LSD devices | Mukta G. Farooq, John A. Fitzsimmons | 2015-08-11 |
| 9064937 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Wei Lin, Deepika Priyadarshini, Tuan A. Vo +1 more | 2015-06-23 |
| 9058974 | Distorting donor wafer to corresponding distortion of host wafer | Wei Lin, Tuan A. Vo | 2015-06-16 |
| 9059039 | Reducing wafer bonding misalignment by varying thermal treatment prior to bonding | Douglas C. La Tulipe, Jr., Wei Lin, Kevin R. Winstel | 2015-06-16 |
| 9059333 | Facilitating chip dicing for metal-metal bonding and hybrid wafer bonding | Mukta G. Farooq, Erdem Kaltalioglu, Wei Lin, Kevin R. Winstel | 2015-06-16 |
| 9028628 | Wafer-to-wafer oxide fusion bonding | Wei Lin, Deepika Priyadarshini, Tuan A. Vo | 2015-05-12 |
| 8900885 | Wafer bonding misalignment reduction | Alex Richard Hubbard, Douglas C. La Tulipe, Jr., Kevin R. Winstel | 2014-12-02 |
| 8765578 | Edge protection of bonded wafers during wafer thinning | Douglas C. La Tulipe, Jr., Tuan A. Vo, Kevin R. Winstel | 2014-07-01 |
| 8563403 | Three dimensional integrated circuit integration using alignment via/dielectric bonding first and through via formation last | Mukta G. Farooq, Richard P. Volant, Kevin R. Winstel | 2013-10-22 |
| 8236705 | Deposition of viscous material | Nitin Parbhoo | 2012-08-07 |
| 7909208 | Process of monitoring dispensing of process fluids in precision processing operations | — | 2011-03-22 |