Issued Patents All Time
Showing 25 most recent of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE50494 | Self-forming embedded diffusion barriers | Cyril Cabral, Jr., Juntao Li, Takeshi Nogami | 2025-07-15 |
| 12341099 | Semiconductor backside transistor integration with backside power delivery network | Ruilong Xie, Rajiv V. Joshi, Ravikumar Ramachandran, Eric R. Miller | 2025-06-24 |
| 12272545 | Embedded metal contamination removal from BEOL wafers | Devika Sil, Ashim Dutta, Yann Mignot, John C. Arnold, Kedari Matam +1 more | 2025-04-08 |
| 11955152 | Dielectric fill for tight pitch MRAM pillar array | Ashim Dutta, Chih-Chao Yang, Theodorus E. Standaert | 2024-04-09 |
| 11937514 | High-density memory devices using oxide gap fill | Theodorus E. Standaert, Chih-Chao Yang | 2024-03-19 |
| 11881433 | Advanced copper interconnects with hybrid microstructure | Chih-Chao Yang | 2024-01-23 |
| 11804405 | Method of forming copper interconnect structure with manganese barrier layer | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2023-10-31 |
| 11557482 | Electrode with alloy interface | Chih-Chao Yang, Chao-Kun Hu, Oscar van der Straten | 2023-01-17 |
| 11462583 | Embedding magneto-resistive random-access memory devices between metal levels | Ashim Dutta, Chih-Chao Yang, John C. Arnold, Theodorus E. Standaert | 2022-10-04 |
| 11302630 | Electrode-via structure | Theodorus E. Standaert, Chih-Chao Yang | 2022-04-12 |
| 11232983 | Copper interconnect structure with manganese barrier layer | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2022-01-25 |
| 11222817 | Advanced copper interconnects with hybrid microstructure | Chih-Chao Yang | 2022-01-11 |
| 11217742 | Bottom electrode for semiconductor memory device | Chih-Chao Yang, Theodorus E. Standaert | 2022-01-04 |
| 11177167 | Ultrathin multilayer metal alloy liner for nano Cu interconnects | Alfred Grill, Seth L. Knupp, Son V. Nguyen, Takeshi Nogami, Vamsi K. Paruchuri +2 more | 2021-11-16 |
| 11145813 | Bottom electrode for semiconductor memory device | Chih-Chao Yang, Theodorus E. Standaert | 2021-10-12 |
| 11081643 | Bevel metal removal using ion beam etch | Ashim Dutta, Saba Zare, Michael Rizzolo, Theodorus E. Standaert | 2021-08-03 |
| 11056425 | Structural enhancement of Cu nanowires | Chih-Chao Yang | 2021-07-06 |
| 11031542 | Contact via with pillar of alternating layers | Chih-Chao Yang, Michael Rizzolo, Theodorus E. Standaert | 2021-06-08 |
| 10892404 | Sacrificial buffer layer for metal removal at a bevel edge of a substrate | Ashim Dutta, Saba Zare, Michael Rizzolo, Theodorus E. Standaert | 2021-01-12 |
| 10833258 | MRAM device formation with in-situ encapsulation | Ashim Dutta, Chih-Chao Yang, Karthik Yogendra, John C. Arnold | 2020-11-10 |
| 10777735 | Contact via structures | Chih-Chao Yang, Bruce B. Doris, Henry K. Utomo, Theodorus E. Standaert, Nathan P. Marchack | 2020-09-15 |
| 10770347 | Interconnect structure | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2020-09-08 |
| 10714683 | Multilayer hardmask for high performance MRAM devices | Michael Rizzolo, Theodorus E. Standaert, Kisup Chung, Isabel Cristina Chu, John C. Arnold | 2020-07-14 |
| 10686124 | Contact via structures | Chih-Chao Yang, Bruce B. Doris, Henry K. Utomo, Theodorus E. Standaert, Nathan P. Marchack | 2020-06-16 |
| 10680169 | Multilayer hardmask for high performance MRAM devices | Michael Rizzolo, Theodorus E. Standaert, Kisup Chung, Isabel Cristina Chu, John C. Arnold | 2020-06-09 |