Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272545 | Embedded metal contamination removal from BEOL wafers | Devika Sil, Ashim Dutta, Yann Mignot, John C. Arnold, Daniel C. Edelstein +1 more | 2025-04-08 |
| 11404311 | Metallic interconnect structures with wrap around capping layers | Cornelius Brown Peethala, Chih-Chao Yang, Theo Standaert | 2022-08-02 |
| 11315830 | Metallic interconnect structures with wrap around capping layers | Cornelius Brown Peethala, Chih-Chao Yang, Theo Standaert | 2022-04-26 |
| 10672653 | Metallic interconnect structures with wrap around capping layers | Cornelius Brown Peethala, Chih-Chao Yang, Theo Standaert | 2020-06-02 |