Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990414 | BEOL alternative metal interconnects: integration and process | Chih-Chao Yang | 2024-05-21 |
| 11404311 | Metallic interconnect structures with wrap around capping layers | Cornelius Brown Peethala, Kedari Matam, Chih-Chao Yang | 2022-08-02 |
| 11315830 | Metallic interconnect structures with wrap around capping layers | Cornelius Brown Peethala, Kedari Matam, Chih-Chao Yang | 2022-04-26 |
| 10886225 | BEOL alternative metal interconnects: integration and process | Chih-Chao Yang | 2021-01-05 |
| 10672649 | Advanced BEOL interconnect architecture | Chih-Chao Yang | 2020-06-02 |
| 10672653 | Metallic interconnect structures with wrap around capping layers | Cornelius Brown Peethala, Kedari Matam, Chih-Chao Yang | 2020-06-02 |
| 10534888 | Hybrid back end of line metallization to balance performance and reliability | Baozhen Li, Chih-Chao Yang | 2020-01-14 |