Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12272545 | Embedded metal contamination removal from BEOL wafers | Ashim Dutta, Yann Mignot, John C. Arnold, Daniel C. Edelstein, Kedari Matam +1 more | 2025-04-08 | |
| 11756786 | Forming high carbon content flowable dielectric film with low processing damage | Benjamin D. Briggs, Donald F. Canaperi, Huy Cao, Thomas J. Haigh, Jr., Son V. Nguyen +2 more | 2023-09-12 | $5,734,000 |
| 11309216 | Large grain copper interconnect lines for MRAM | Alexander Reznicek, Oleg Gluschenkov, Yasir Sulehria | 2022-04-19 | $6,872,000 |
| 11302637 | Interconnects including dual-metal vias | Balasubramanian S. Pranatharthi Haran, Takeshi Nogami | 2022-04-12 | $4,292,000 |
| 11114606 | MRAM devices containing a harden gap fill dielectric material | Alexander Reznicek, Oleg Gluschenkov, Yasir Sulehria | 2021-09-07 | $7,685,000 |
| 10978342 | Interconnect with self-forming wrap-all-around barrier layer | Huai Huang, Takeshi Nogami, Alfred Grill, Benjamin D. Briggs, Nicholas Anthony Lanzillo +3 more | 2021-04-13 | $3,936,000 |