Issued Patents All Time
Showing 1–25 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424549 | Skip-level TSV with hybrid dielectric scheme for backside power delivery | Nicholas Anthony Lanzillo, Ruilong Xie, Hosadurga Shobha, Lawrence A. Clevenger | 2025-09-23 |
| 12424557 | Dual structured buried rail | Nicholas Anthony Lanzillo, Ruilong Xie, Hosadurga Shobha, Lawrence A. Clevenger | 2025-09-23 |
| 12412836 | Backside power plane | Ruilong Xie, Nicholas Anthony Lanzillo, Hosadurga Shobha, Lawrence A. Clevenger | 2025-09-09 |
| 12334442 | Dielectric caps for power and signal line routing | Nicholas Anthony Lanzillo, Ruilong Xie, Lawrence A. Clevenger, Hosadurga Shobha | 2025-06-17 |
| 12261056 | Top via patterning using metal as hard mask and via conductor | Nicholas Anthony Lanzillo, Hosadurga Shobha, Lawrence A. Clevenger, Chanro Park | 2025-03-25 |
| 12218003 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha | 2025-02-04 |
| 11955424 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo | 2024-04-09 |
| 11944013 | Magnetic tunnel junction device with minimum stray field | Heng Wu, Dimitri Houssameddine, Tianji Zhou | 2024-03-26 |
| 11756887 | Backside floating metal for increased capacitance | Nicholas Anthony Lanzillo, Hosadurga Shobha, Lawrence A. Clevenger | 2023-09-12 |
| 11676854 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha | 2023-06-13 |
| 11621199 | Silicide formation for source/drain contact in a vertical transport field-effect transistor | Heng Wu, Su Chen Fan, Ruilong Xie | 2023-04-04 |
| 11621189 | Barrier-less prefilled via formation | Nicholas Anthony Lanzillo, Hosadurga Shobha, Junli Wang, Lawrence A. Clevenger, Christopher J. Penny +1 more | 2023-04-04 |
| 11574864 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo | 2023-02-07 |
| 11315827 | Skip via connection between metallization levels | Lawrence A. Clevenger, Hosadurga Shobha, Christopher J. Penny, Nicholas Anthony Lanzillo | 2022-04-26 |
| 11244861 | Method and structure for forming fully-aligned via | Ruilong Xie, Christopher J. Waskiewicz, Chih-Chao Yang | 2022-02-08 |
| 11177162 | Trapezoidal interconnect at tight BEOL pitch | Nicholas Anthony Lanzillo, Hosadurga Shobha, Junli Wang, Koichi Motoyama, Christopher J. Penny +1 more | 2021-11-16 |
| 11158543 | Silicide formation for source/drain contact in a vertical transport field-effect transistor | Heng Wu, Su Chen Fan, Ruilong Xie | 2021-10-26 |
| 11152257 | Barrier-less prefilled via formation | Nicholas Anthony Lanzillo, Hosadurga Shobha, Junli Wang, Lawrence A. Clevenger, Christopher J. Penny +1 more | 2021-10-19 |
| 11056429 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo | 2021-07-06 |
| 10978342 | Interconnect with self-forming wrap-all-around barrier layer | Takeshi Nogami, Alfred Grill, Benjamin D. Briggs, Nicholas Anthony Lanzillo, Christian Lavoie +3 more | 2021-04-13 |
| 10964588 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha | 2021-03-30 |
| 10943866 | Method and structure to construct cylindrical interconnects to reduce resistance | Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Lawrence A. Clevenger, Hosadurga Shobha | 2021-03-09 |
| 10784197 | Method and structure to construct cylindrical interconnects to reduce resistance | Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Lawrence A. Clevenger, Hosadurga Shobha | 2020-09-22 |
| 10784156 | Self-aligned airgaps with conductive lines and vias | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo | 2020-09-22 |
| 10777411 | Semiconductor device with selective dielectric deposition | Son V. Nguyen, Benjamin D. Briggs | 2020-09-15 |