| 12469777 |
BEOL interconnect subtractive etch super via |
Prasad Bhosale, Nicholas Anthony Lanzillo, Lawrence A. Clevenger |
2025-11-11 |
|
| 12464960 |
Metal hard mask integration for active device structures |
Takashi Ando, Lawrence A. Clevenger, Kevin W. Brew |
2025-11-04 |
|
| 12464731 |
Layered bottom electrode dielectric for embedded MRAM |
Ashim Dutta, Jon Slaughter, Cho-Chuan Yang, Theodorus E. Standaert |
2025-11-04 |
|
| 12457905 |
Patterning magnetic tunnel junctions and the like while reducing detrimental resputtering of underlying features |
Ki Woo Chung, Fee Li Lie |
2025-10-28 |
|
| 12439608 |
MRAM integration with self-aligned direct back side contact |
Ruinan Xie, Nicholas Anthony Lanzillo, Koichi Motoyama, Brent A. Anderson, Lawrence A. Clevenger |
2025-10-07 |
|
| 12218003 |
Selective ILD deposition for fully aligned via with airgap |
Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha |
2025-02-04 |
|
| 11955424 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny |
2024-04-09 |
|
| 11942126 |
Selectively biasing magnetoresistive random-access memory cells |
Saba Zare, Virat Vasav Mehta, Eric Raymond Evarts |
2024-03-26 |
$9,065,000 |
| 11869561 |
Spin orbit-torque magnetic random-access memory (SOT-MRAM) with cross-point spin hall effect (SHE) write lines and remote sensing read magnetic tunnel-junction (MTJ) |
Julien Frougier, Dimitri Houssameddine, Ruilong Xie, Kangguo Cheng |
2024-01-09 |
$9,963,000 |
| 11869783 |
Optimizating semiconductor binning by feed-forward process adjustment |
Benjamin D. Briggs, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Theodorus E. Standaert, James H. Stathis |
2024-01-09 |
$9,963,000 |
| 11812668 |
Pillar-based memory hardmask smoothing and stress reduction |
Theodorus E. Standaert, Ashim Dutta, Dominik Metzler |
2023-11-07 |
$6,695,000 |
| 11790072 |
Paint on micro chip touch screens |
Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger +1 more |
2023-10-17 |
$7,011,000 |
| 11735524 |
Electrical device having conductive lines with air gaps therebetween and interconnects without exclusion zones |
Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny |
2023-08-22 |
$5,113,000 |
| 11711982 |
Laser anneal for MRAM encapsulation enhancement |
Oscar van der Straten, Alexander Reznicek, Oleg Gluschenkov |
2023-07-25 |
$11,323,000 |
| 11676854 |
Selective ILD deposition for fully aligned via with airgap |
Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha |
2023-06-13 |
$11,668,000 |
| 11665974 |
MRAM containing magnetic top contact |
Saba Zare, Virat Vasav Mehta, Eric Raymond Evarts |
2023-05-30 |
$4,328,000 |
| 11636353 |
Cognitive system for localized LIDAR pollution detection using autonomous vehicles |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger |
2023-04-25 |
$8,760,000 |
| 11610941 |
Integrated non volatile memory electrode thin film resistor cap and etch stop |
Kevin W. Brew, Takashi Ando, Lawrence A. Clevenger |
2023-03-21 |
$41,358,000 |
| 11574864 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny |
2023-02-07 |
$5,433,000 |
| 11569442 |
Dielectric retention and method of forming memory pillar |
Saba Zare, Mona A. Ebrish, Theodorus E. Standaert |
2023-01-31 |
$7,725,000 |
| 11552243 |
MRAM structure with ternary weight storage |
Alexander Reznicek, Bahman Hekmatshoartabari, Ravi Nair |
2023-01-10 |
$10,956,000 |
| 11502242 |
Embedded memory devices |
Ashim Dutta, Chih-Chao Yang, Theodorus E. Standaert |
2022-11-15 |
$5,426,000 |
| 11488863 |
Self-aligned contact scheme for pillar-based memory elements |
Benjamin D. Briggs, Nicholas Anthony Lanzillo |
2022-11-01 |
$6,203,000 |
| 11476415 |
Patterning magnetic tunnel junctions and the like while reducing detrimental resputtering of underlying features |
Kisup Chung, Fee Li Lie |
2022-10-18 |
$6,904,000 |
| 11444029 |
Back-end-of-line interconnect structures with varying aspect ratios |
Prasad Bhosale, Nicholas Anthony Lanzillo, Chih-Chao Yang |
2022-09-13 |
$6,415,000 |
