Issued Patents All Time
Showing 51–75 of 201 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971030 | Remote physical training | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Aldis Sipolins | 2021-04-06 |
| 10964588 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha | 2021-03-30 |
| 10957850 | Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication | Ashim Dutta, Isabel Cristina Chu, Son V. Nguyen, John C. Arnold | 2021-03-23 |
| 10957646 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Cornelius Brown Peethala, Koichi Motoyama, Gen Tsutsui, Ruqiang Bao +2 more | 2021-03-23 |
| 10957622 | Spatially localized thermal interface materials | Jonathan Fry, Tuhin Sinha | 2021-03-23 |
| 10957582 | Self aligned via and pillar cut for at least a self aligned double pitch | Benjamin D. Briggs, Lawrence A. Clevenger, Terry A. Spooner, Theodorus E. Standaert | 2021-03-23 |
| 10957581 | Self aligned via and pillar cut for at least a self aligned double pitch | Benjamin D. Briggs, Lawrence A. Clevenger, Terry A. Spooner, Theodorus E. Standaert | 2021-03-23 |
| 10950662 | Resistive memory device with meshed electrodes | Takashi Ando, Lawrence A. Clevenger, Chih-Chao Yang | 2021-03-16 |
| 10943866 | Method and structure to construct cylindrical interconnects to reduce resistance | Benjamin D. Briggs, Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha | 2021-03-09 |
| 10916501 | Back end of line electrical fuse structure and method of fabrication | Benjamin D. Briggs, Lawrence A. Clevenger, Chih-Chao Yang | 2021-02-09 |
| 10912986 | Dynamic rigidity mechanism | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo | 2021-02-09 |
| 10915620 | Paint on micro chip touch screens | Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger +1 more | 2021-02-09 |
| 10903162 | Fuse element resistance enhancement by laser anneal and ion implantation | Liying Jiang, Juntao Li, Chih-Chao Yang, Yi Song | 2021-01-26 |
| 10901317 | Extreme ultraviolet (EUV) lithography patterning methods utilizing EUV resist hardening | Benjamin D. Briggs, Ekmini Anuja De Silva, Chih-Chao Yang, Lawrence A. Clevenger | 2021-01-26 |
| 10901030 | Viscoelastic pad upon integrated circuit device contact for multipass electrical characterization probe testing | Max S. Cioban, Jonathan Fry, Tuhin Sinha | 2021-01-26 |
| 10903184 | Filler particle position and density manipulation with applications in thermal interface materials | Jonathan Fry, Tuhin Sinha, Bassem M. Hamieh | 2021-01-26 |
| 10892404 | Sacrificial buffer layer for metal removal at a bevel edge of a substrate | Ashim Dutta, Saba Zare, Theodorus E. Standaert, Daniel C. Edelstein | 2021-01-12 |
| 10833122 | Bottom electrode and dielectric structure for MRAM applications | Hari Prasad Amanapu, Raghuveer R. Patlolla, Cornelius Brown Peethala | 2020-11-10 |
| 10833266 | Resistive memory crossbar array with ruthenium protection layer | Takashi Ando, Lawrence A. Clevenger, Chih-Chao Yang | 2020-11-10 |
| 10830841 | Magnetic tunnel junction performance monitoring based on magnetic field coupling | Nicholas Anthony Lanzillo, Benjamin D. Briggs, Lawrence A. Clevenger, Theodorus E. Standaert, James H. Stathis | 2020-11-10 |
| 10833127 | Three-dimensional and planar memory device co-integration | Takashi Ando, Chih-Chao Yang, Lawrence A. Clevenger | 2020-11-10 |
| 10811599 | Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size | Lawrence A. Clevenger, Liying Jiang, Sebastian Naczas, Chih-Chao Yang | 2020-10-20 |
| 10812417 | Auto-incorrect in chatbot human-machine interfaces | Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christoper J. Penny, Aldis Sipolins | 2020-10-20 |
| 10796911 | Hardmask stress, grain, and structure engineering for advanced memory applications | Ashim Dutta, Oscar van der Straten, Chih-Chao Yang | 2020-10-06 |
| 10796833 | Magnetic tunnel junction with low series resistance | Nicholas Anthony Lanzillo, Benjamin D. Briggs, Theodorus E. Standaert, Lawrence A. Clevenger, James H. Stathis | 2020-10-06 |