Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431404 | Fatigue failure resistant electronic package | Kamal K. Sikka, Shidong Li, Jeffrey A. Zitz | 2025-09-30 |
| 12109050 | Method and system for acquiring data for assessment of cardiovascular disease | Ian Eslick, Alan Leggitt | 2024-10-08 |
| 12094613 | Method and system for cardiovascular disease assessment and management | Ian Eslick, Alan Leggitt | 2024-09-17 |
| 11872061 | Method and system for acquiring data for assessment of cardiovascular disease | Ian Eslick, Alan Leggitt | 2024-01-16 |
| 11862340 | Method and system for cardiovascular disease assessment and management | Ian Eslick, Alan Leggitt | 2024-01-02 |
| 11830624 | System and method for determining data quality for cardiovascular parameter determination | Mark Brian Mozolewski | 2023-11-28 |
| 11744523 | System and method for validating cardiovascular parameter monitors | — | 2023-09-05 |
| 11424032 | Method and system for cardiovascular disease assessment and management | Ian Eslick, Alan Leggitt | 2022-08-23 |
| 11410905 | Optimized weight heat spreader for an electronic package | Kamal K. Sikka, Kenneth C. Marston, Shidong Li | 2022-08-09 |
| 11324411 | Method and system for determining cardiovascular parameters | Alan Leggitt | 2022-05-10 |
| 11308257 | Stacked via rivets in chip hotspots | Dureseti Chidambarrao, David Wolpert, Atsushi Ogino, Matthew T. Guzowski, Steven P. Ostrander +1 more | 2022-04-19 |
| 11266356 | Method and system for acquiring data for assessment of cardiovascular disease | Ian Eslick, Alan Leggitt | 2022-03-08 |
| 11239183 | Mitigating thermal-mechanical strain and warpage of an organic laminate substrate | Krishna R. Tunga, Brian W. Quinlan, Charles L. Arvin, Steven P. Ostrander, Thomas Weiss | 2022-02-01 |
| 11211262 | Electronic apparatus having inter-chip stiffener | Steven P. Ostrander, Bhupender Singh, Sylvain Ouimet | 2021-12-28 |
| 11133268 | Crack bifurcation in back-end-of-line | Naftali E. Lustig | 2021-09-28 |
| 10978314 | Multi integrated circuit chip carrier package | Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2021-04-13 |
| 10957622 | Spatially localized thermal interface materials | Jonathan Fry, Michael Rizzolo | 2021-03-23 |
| 10903184 | Filler particle position and density manipulation with applications in thermal interface materials | Jonathan Fry, Michael Rizzolo, Bassem M. Hamieh | 2021-01-26 |
| 10901030 | Viscoelastic pad upon integrated circuit device contact for multipass electrical characterization probe testing | Max S. Cioban, Jonathan Fry, Michael Rizzolo | 2021-01-26 |
| 10804181 | Heterogeneous thermal interface material for corner and or edge degradation mitigation | Marcus E. Interrante, Sushumna Iruvanti, Shidong Li | 2020-10-13 |
| 10553503 | Method and structure for flip-chip package reliability monitoring using capacitive sensors groups | Taryn J. Davis, Jonathan Fry | 2020-02-04 |
| 10541211 | Control warpage in a semiconductor chip package | Krishna R. Tunga | 2020-01-21 |
| 10541156 | Multi integrated circuit chip carrier package | Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2020-01-21 |
| 10420515 | Method and system for acquiring data for assessment of cardiovascular disease | Ian Eslick, Alan Leggitt | 2019-09-24 |
| 10420475 | Method and system for cardiovascular disease assessment and management | Ian Eslick, Alan Leggitt | 2019-09-24 |