Issued Patents All Time
Showing 25 most recent of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437312 | High performance metal insulator metal capacitor | Jim Shih-Chun Liang, Atsushi Ogino, Nan Jing | 2022-09-06 |
| 11205588 | Interconnect architecture with enhanced reliability | Baozhen Li, Chih-Chao Yang | 2021-12-21 |
| 11133268 | Crack bifurcation in back-end-of-line | Tuhin Sinha | 2021-09-28 |
| 11011415 | Airgap vias in electrical interconnects | Rasit Onur Topaloglu, Matthew S. Angyal | 2021-05-18 |
| 10998263 | Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) device | Jim Shih-Chun Liang, Baozhen Li, Ning Lu | 2021-05-04 |
| 10796949 | Airgap vias in electrical interconnects | Rasit Onur Topaloglu, Matthew S. Angyal | 2020-10-06 |
| 10256186 | Interconnect structure having subtractive etch feature and damascene feature | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon | 2019-04-09 |
| 10229875 | Stacked via structure for metal fuse applications | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Andrew H. Simon +1 more | 2019-03-12 |
| 10224236 | Forming air gap | Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Griselda Bonilla, Andrew H. Simon | 2019-03-05 |
| 10177031 | Subtractive etch interconnects | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon | 2019-01-08 |
| 10103068 | Detecting a void between a via and a wiring line | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon | 2018-10-16 |
| 9893011 | Back-end electrically programmable fuse | Junjing Bao, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi +3 more | 2018-02-13 |
| 9859208 | Bottom self-aligned via | Matthew S. Angyal, Rasit Onur Topaloglu | 2018-01-02 |
| 9852980 | Interconnect structure having substractive etch feature and damascene feature | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon | 2017-12-26 |
| 9685404 | Back-end electrically programmable fuse | Junjing Bao, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi +3 more | 2017-06-20 |
| 9601426 | Interconnect structure having subtractive etch feature and damascene feature | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon | 2017-03-21 |
| 9536842 | Structure with air gap crack stop | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Xiao Hu Liu +1 more | 2017-01-03 |
| 9536830 | High performance refractory metal / copper interconnects to eliminate electromigration | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon | 2017-01-03 |
| 9524916 | Structures and methods for determining TDDB reliability at reduced spacings using the structures | Ronald G. Filippi, Erdem Kaltalioglu, Ping-Chuan Wang, Lijuan Zhang | 2016-12-20 |
| 9502350 | Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layer | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon | 2016-11-22 |
| 9455186 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more | 2016-09-27 |
| 9431292 | Alternate dual damascene method for forming interconnects | Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon | 2016-08-30 |
| 9431346 | Graphene-metal E-fuse | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew Tae Kim +1 more | 2016-08-30 |
| 9425144 | Metal fuse structure for improved programming capability | Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow +2 more | 2016-08-23 |
| 9406560 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more | 2016-08-02 |