| 11437312 |
High performance metal insulator metal capacitor |
Jim Shih-Chun Liang, Atsushi Ogino, Nan Jing |
2022-09-06 |
$10,660,000 |
| 11205588 |
Interconnect architecture with enhanced reliability |
Baozhen Li, Chih-Chao Yang |
2021-12-21 |
$5,237,000 |
| 11133268 |
Crack bifurcation in back-end-of-line |
Tuhin Sinha |
2021-09-28 |
$6,479,000 |
| 11011415 |
Airgap vias in electrical interconnects |
Rasit Onur Topaloglu, Matthew S. Angyal |
2021-05-18 |
$4,116,000 |
| 10998263 |
Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) device |
Jim Shih-Chun Liang, Baozhen Li, Ning Lu |
2021-05-04 |
$7,263,000 |
| 10796949 |
Airgap vias in electrical interconnects |
Rasit Onur Topaloglu, Matthew S. Angyal |
2020-10-06 |
$5,751,000 |
| 10256186 |
Interconnect structure having subtractive etch feature and damascene feature |
Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon |
2019-04-09 |
$2,400,000 |
| 10229875 |
Stacked via structure for metal fuse applications |
Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Andrew H. Simon +1 more |
2019-03-12 |
$2,141,000 |
| 10224236 |
Forming air gap |
Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Griselda Bonilla, Andrew H. Simon |
2019-03-05 |
$23,702,000 |
| 10177031 |
Subtractive etch interconnects |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon |
2019-01-08 |
$2,287,000 |
| 10103068 |
Detecting a void between a via and a wiring line |
Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon |
2018-10-16 |
$22,287,000 |
| 9893011 |
Back-end electrically programmable fuse |
Junjing Bao, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi +3 more |
2018-02-13 |
$2,196,000 |
| 9859208 |
Bottom self-aligned via |
Matthew S. Angyal, Rasit Onur Topaloglu |
2018-01-02 |
$1,907,000 |
| 9852980 |
Interconnect structure having substractive etch feature and damascene feature |
Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon |
2017-12-26 |
$2,704,000 |
| 9685404 |
Back-end electrically programmable fuse |
Junjing Bao, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi +3 more |
2017-06-20 |
$2,315,000 |
| 9601426 |
Interconnect structure having subtractive etch feature and damascene feature |
Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon |
2017-03-21 |
$2,195,000 |
| 9536842 |
Structure with air gap crack stop |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Xiao Hu Liu +1 more |
2017-01-03 |
$6,197,000 |
| 9536830 |
High performance refractory metal / copper interconnects to eliminate electromigration |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon |
2017-01-03 |
$6,197,000 |
| 9524916 |
Structures and methods for determining TDDB reliability at reduced spacings using the structures |
Ronald G. Filippi, Erdem Kaltalioglu, Ping-Chuan Wang, Lijuan Zhang |
2016-12-20 |
$6,917,000 |
| 9502350 |
Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layer |
Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon |
2016-11-22 |
$3,414,000 |
| 9455186 |
Selective local metal cap layer formation for improved electromigration behavior |
Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more |
2016-09-27 |
$4,099,000 |
| 9431292 |
Alternate dual damascene method for forming interconnects |
Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon |
2016-08-30 |
$3,218,000 |
| 9431346 |
Graphene-metal E-fuse |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew Tae Kim +1 more |
2016-08-30 |
$3,218,000 |
| 9425144 |
Metal fuse structure for improved programming capability |
Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow +2 more |
2016-08-23 |
$3,675,000 |
| 9406560 |
Selective local metal cap layer formation for improved electromigration behavior |
Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more |
2016-08-02 |
$5,615,000 |
