Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688680 | MIM capacitor structures | Baozhen Li, Chih-Chao Yang | 2023-06-27 |
| 11437312 | High performance metal insulator metal capacitor | Naftali E. Lustig, Atsushi Ogino, Nan Jing | 2022-09-06 |
| 11257750 | E-fuse co-processed with MIM capacitor | Baozhen Li, Chih-Chao Yang, Ernest Y. Wu | 2022-02-22 |
| 11244850 | On integrated circuit (IC) device simultaneously formed capacitor and resistor | Baozhen Li, Chih-Chao Yang | 2022-02-08 |
| 11145591 | Integrated circuit (IC) device integral capacitor and anti-fuse | Baozhen Li, Chih-Chao Yang | 2021-10-12 |
| 11101213 | EFuse structure with multiple links | Baozhen Li, Chih-Chao Yang, Tian Shen | 2021-08-24 |
| 10998263 | Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) device | Naftali E. Lustig, Baozhen Li, Ning Lu | 2021-05-04 |
| 10741497 | Contact and interconnect structures | — | 2020-08-11 |
| 10490501 | Method to form interconnect structure with tungsten fill | Keith Kwong Hon Wong | 2019-11-26 |
| 10403574 | Method to reduce resistance for a copper (Cu) interconnect landing on multilayered metal contacts, and semiconductor structures formed therefrom | Atsushi Ogino, Justin C. Long | 2019-09-03 |
| 10354918 | Contact element structure of a semiconductor device | — | 2019-07-16 |
| 10347529 | Interconnect structures | Keith Kwong Hon Wong | 2019-07-09 |
| 10249534 | Method of forming a contact element of a semiconductor device and contact element structure | — | 2019-04-02 |
| 9991202 | Method to reduce resistance for a copper (CU) interconnect landing on multilayered metal contacts, and semiconductor structures formed therefrom | Justin C. Long, Atsushi Ogino | 2018-06-05 |
| 9793216 | Fabrication of IC structure with metal plug | Joyeeta Nag, Domingo A. Ferrer Luppi, Atsushi Ogino, Andrew H. Simon, Michael P. Chudzik | 2017-10-17 |
| 9633946 | Seamless metallization contacts | Domingo A. Ferrer, Kathryn T. Schonenberg, Shahrukh Khan, Wei-Tsu Tseng | 2017-04-25 |
| 9589912 | Integrated circuit structure with crack stop and method of forming same | Atsushi Ogino, Stephen E. Greco, Roger QUON | 2017-03-07 |
| 9589911 | Integrated circuit structure with metal crack stop and methods of forming same | Atsushi Ogino, Roger QUON, Stephen E. Greco | 2017-03-07 |
| 9293365 | Hardmask removal for copper interconnects with tungsten contacts by chemical mechanical polishing | Domingo A. Ferrer, Joyeeta Nag, Wei-Tsu Tseng, George S. Tulevski | 2016-03-22 |