Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340183 | Cobalt plated via integration scheme | Qiang Fang, Shafaat Ahmed, Zhiguo Sun, Jiehui Shu, Dinesh R. Koli | 2019-07-02 |
| 10109505 | Dual medium filter for ion and particle filtering during semiconductor processing | John H. Zhang, Laertis Economikos, Adam Ticknor | 2018-10-23 |
| 9633946 | Seamless metallization contacts | Jim Shih-Chun Liang, Domingo A. Ferrer, Kathryn T. Schonenberg, Shahrukh Khan | 2017-04-25 |
| 9607864 | Dual medium filter for ion and particle filtering during semiconductor processing | John H. Zhang, Laertis Economikos, Adam Ticknor | 2017-03-28 |
| 9293365 | Hardmask removal for copper interconnects with tungsten contacts by chemical mechanical polishing | Domingo A. Ferrer, Jim Shih-Chun Liang, Joyeeta Nag, George S. Tulevski | 2016-03-22 |
| 9059177 | Doping of copper wiring structures in back end of line processing | Thomas W. Dyer, Daniel C. Edelstein, Tze-man Ko, Andrew H. Simon | 2015-06-16 |
| 8920567 | Post metal chemical-mechanical planarization cleaning process | Vamsi Devarapalli, Colin J. Goyette, Michael R. Kennett, Mahmoud Khojasteh, Qinghuang Lin +2 more | 2014-12-30 |
| 8822994 | Method of repairing probe pads | John H. Zhang, Laertis Economikos, Robin Van Den Nieuwenhuizen | 2014-09-02 |
| 8765602 | Doping of copper wiring structures in back end of line processing | Thomas W. Dyer, Daniel C. Edelstein, Tze-man Ko, Andrew H. Simon | 2014-07-01 |
| 8324622 | Method of repairing probe pads | John H. Zhang, Laertis Economikos, Robin Van Den Nieuwenhuizen | 2012-12-04 |
| 7556972 | Detection and characterization of SiCOH-based dielectric materials during device fabrication | Manoj Balachandran, James A. Hagan, Ben Kim, Deoram Persaud, Adam Ticknor | 2009-07-07 |
| 7510463 | Extended life conditioning disk | Ben Kim, Manoj Balachandran, James A. Hagan, Deoram Persaud, Adam Ticknor | 2009-03-31 |
| 7407879 | Chemical planarization performance for copper/low-k interconnect structures | Lee M. Nicholson, Christy S. Tyberg | 2008-08-05 |
| 7253098 | Maintaining uniform CMP hard mask thickness | Shyng-Tsong Chen, Kaushik A. Kumar, Stephen E. Greco, Shom Ponoth, Terry A. Spooner +1 more | 2007-08-07 |
| 7190079 | Selective capping of copper wiring | Panayotis Andricacos, Shyng-Tsong Chen, John M. Cotte, Hariklia Deligianni, Mahadevaiyer Krishnan +1 more | 2007-03-13 |
| 7071539 | Chemical planarization performance for copper/low-k interconnect structures | Lee M. Nicholson, Christy S. Tyberg | 2006-07-04 |
| 7064064 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2006-06-20 |
| 7008871 | Selective capping of copper wiring | Panayotis Andricacos, Shyng-Tsong Chen, John M. Cotte, Hariklia Deligianni, Mahadevaiyer Krishnan +1 more | 2006-03-07 |
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2005-12-13 |
| 6660820 | Low dielectric constant polymer and monomers used in their formation | Arthur Winston Martin | 2003-12-09 |
| 6441465 | Scribe line structure for preventing from damages thereof induced during fabrication | Chi-Fa Lin, Min Feng | 2002-08-27 |
| 6235608 | STI process by method of in-situ multilayer dielectric deposition | Chi-Fa Lin, Min Feng | 2001-05-22 |
| 6165886 | Advanced IC bonding pad design for preventing stress induced passivation cracking and pad delimitation through stress bumper pattern and dielectric pin-on effect | Chi-Fa Lin, Min Feng | 2000-12-26 |
| 5922091 | Chemical mechanical polishing slurry for metallic thin film | Ming-Shih Tsai | 1999-07-13 |