Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE45781 | Toughness, adhesion and smooth metal lines of porous low K dielectric interconnect structures | Jeffrey Hedrick, Kang-Wook Lee, Kelly Malone | 2015-10-27 |
| 8569803 | BEOL compatible FET structrure | Katherine L. Saenger, Jack O. Chu, Harold J. Hovel, Robert L. Wisnieff, Kerry Bernstein +1 more | 2013-10-29 |
| 8445377 | Mechanically robust metal/low-k interconnects | Qinghuang Lin, Terry A. Spooner, Darshan Gandhi | 2013-05-21 |
| 8441042 | BEOL compatible FET structure | Katherine L. Saenger, Jack O. Chu, Harold J. Hovel, Robert L. Wisnieff, Kerry Bernstein +1 more | 2013-05-14 |
| 8278155 | Reprogrammable fuse structure and method | Geoffrey Burr, Chandrasekharan Kothandaraman, Chung H. Lam, Xiao Hu Liu, Stephen M. Rossnagel +1 more | 2012-10-02 |
| 8017522 | Mechanically robust metal/low-κ interconnects | Qinghuang Lin, Terry A. Spooner, Darshan Gandhi | 2011-09-13 |
| 7960808 | Reprogrammable fuse structure and method | Geoffrey Burr, Chandrasekharan Kothandaraman, Chung H. Lam, Xiao Hu Liu, Stephen M. Rossnagel +1 more | 2011-06-14 |
| 7879717 | Polycarbosilane buried etch stops in interconnect structures | Elbert E. Huang, Kaushik A. Kumar, Kelly Malone, Dirk Pfeiffer, Muthumanickam Sankarapandian | 2011-02-01 |
| 7755921 | Method and apparatus for fabricating sub-lithography data tracks for use in magnetic shift register memory devices | Solomon Assefa, Michael C. Gaidis, Eric A. Joseph, Stuart Stephen Papworth Parkin | 2010-07-13 |
| 7737561 | Dual damascene integration of ultra low dielectric constant porous materials | Kaushik A. Kumar, Kelly Malone | 2010-06-15 |
| 7598169 | Method to remove beol sacrificial materials and chemical residues by irradiation | Qinghuang Lin, Elbert E. Huang, Ronald A. DellaGuardia | 2009-10-06 |
| 7491965 | Heat-shielded low power PCM-based reprogrammable eFUSE device | James P. Doyle, Bruce G. Elmegreen, Lia Krusin-Elbaum, Chung H. Lam, Xiao Hu Liu +1 more | 2009-02-17 |
| 7407879 | Chemical planarization performance for copper/low-k interconnect structures | Lee M. Nicholson, Wei-Tsu Tseng | 2008-08-05 |
| 7396758 | Polycarbosilane buried etch stops in interconnect structures | Elbert E. Huang, Kaushik A. Kumar, Kelly Malone, Dirk Pfeiffer, Muthumanickam Sankarapandian | 2008-07-08 |
| 7394089 | Heat-shielded low power PCM-based reprogrammable EFUSE device | James P. Doyle, Bruce G. Elmegreen, Lia Krusin-Elbaum, Chung H. Lam, Xiao Hu Liu +1 more | 2008-07-01 |
| 7388273 | Reprogrammable fuse structure and method | Geoffrey Burr, Chandrasekharan Kothandaraman, Chung H. Lam, Xiao Hu Liu, Stephen M. Rossnagel +1 more | 2008-06-17 |
| 7365378 | MOSFET structure with ultra-low K spacer | Elbert E. Huang, Philip J. Oldiges, Ghavam G. Shahidi, Xinlin Wang, Robert L. Wisnieff | 2008-04-29 |
| 7338895 | Method for dual damascene integration of ultra low dielectric constant porous materials | Kaushik A. Kumar, Kelly Malone | 2008-03-04 |
| 7329600 | Low dielectric semiconductor device and process for fabricating the same | Lawrence A. Clevenger, Louis L. Hsu, Tsorng-Dih Yuan | 2008-02-12 |
| 7187081 | Polycarbosilane buried etch stops in interconnect structures | Elbert E. Huang, Kaushik A. Kumar, Kelly Malone, Dirk Pfeiffer, Muthumanickam Sankarapandian | 2007-03-06 |
| 7084479 | Line level air gaps | Shyng-Tsong Chen, Stefanie Chiras, Matthew E. Colburn, Timothy J. Dalton, Jeffrey Hedrick +9 more | 2006-08-01 |
| 7071539 | Chemical planarization performance for copper/low-k interconnect structures | Lee M. Nicholson, Wei-Tsu Tseng | 2006-07-04 |
| 7057287 | Dual damascene integration of ultra low dielectric constant porous materials | Kaushik A. Kumar, Kelly Malone | 2006-06-06 |
| 6982227 | Single and multilevel rework | Edward C. Cooney, III, Robert M. Geffken, Vincent J. McGahay, William T. Motsiff, Mark P. Murray +4 more | 2006-01-03 |
| 6933586 | Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens | Ann R. Fornof, Jeffrey Hedrick, Kang-Wook Lee | 2005-08-23 |