Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9081606 | Asynchronous persistent stores for transactions | Gary Dale Carpenter, Alexandre Peixoto Ferreira, Jente B. Kuang, Karthick Rajamani, Freeman Leigh Rawson, III | 2015-07-14 |
| 8897062 | Memory programming for a phase change memory cell | Matthew J. Breitwisch, Roger W. Cheek, Ibrahim M. Elfadel, Michele M. Franceschini, John P. Karidis +3 more | 2014-11-25 |
| 8230276 | Writing to memory using adaptive write techniques | Michele M. Franceschini, John P. Karidis, Luis A. Lastras, Mayank Sharma | 2012-07-24 |
| 8166368 | Writing a special symbol to a memory to indicate the absence of a data signal | Luis A. Lastras-Montano, John P. Karidis, Mayank Sharma, Thomas Mittelholzer, Michele M. Franceschini | 2012-04-24 |
| 8023345 | Iteratively writing contents to memory locations using a statistical model | Matthew J. Breitwisch, Roger W. Cheek, Ibrahim M. Elfadel, Michele M. Franceschini, John P. Karidis +3 more | 2011-09-20 |
| 7825516 | Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures | Michael Lane, Sandra G. Malhotra, Fenton R. Mc Feely, Robert Rosenberg, Carlos J. Sambucetti +1 more | 2010-11-02 |
| 7820559 | Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer | Lawrence A. Clevenger, Timothy J. Dalton, James J. Demarest, Darren N. Dunn, Chester T. Dziobkowski +7 more | 2010-10-26 |
| 7495338 | Metal capped copper interconnect | Michael Lane, Terry A. Spooner, Robert Rosenberg, Daniel C. Edelstein | 2009-02-24 |
| 7402532 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Timothy J. Dalton, James J. Demarest, Derren N. Dunn, Chester T. Dziobkowski +7 more | 2008-07-22 |
| 7273803 | Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure | Yu-Ting Cheng, Donald W. Henderson, Sung Kwon Kang, Stephen Kilpatrick, Henry A. Nye, III +2 more | 2007-09-25 |
| 7217655 | Electroplated CoWP composite structures as copper barrier layers | Cyril Cabral, Jr., Emanuel I. Cooper, Hariklia Deligianni, Andrew J. Kellock, Judith M. Rubino +1 more | 2007-05-15 |
| 7193323 | Electroplated CoWP composite structures as copper barrier layers | Cyril Cabral, Jr., Emanuel I. Cooper, Hariklia Deligianni, Andrew J. Kellock, Judith M. Rubino +1 more | 2007-03-20 |
| 7119018 | Copper conductor | Michael Lane, Terry A. Spooner, Robert Rosenberg, Daniel C. Edelstein | 2006-10-10 |
| 7102232 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Timothy J. Dalton, James J. Demarest, Derren N. Dunn, Chester T. Dziobkowski +7 more | 2006-09-05 |
| 7084479 | Line level air gaps | Shyng-Tsong Chen, Matthew E. Colburn, Timothy J. Dalton, Jeffrey Hedrick, Elbert E. Huang +9 more | 2006-08-01 |