Issued Patents All Time
Showing 25 most recent of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10130460 | Stent having exterior path | So Hee Jung, Young Jae Lee, Jong-Kyun Lee | 2018-11-20 |
| 9867704 | Cardiac valve fixing device | Han Cheol Lee, Seung Hwan Jegal, Ui Soo Jang | 2018-01-16 |
| 9872394 | Substrate via filling | Steven A. Cordes, Bing Dang, Yu Luo, Peter J. Sorce | 2018-01-16 |
| 9433101 | Substrate via filling | Steven A. Cordes, Bing Dang, Yu Luo, Peter J. Sorce | 2016-08-30 |
| 9082762 | Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip | Paul A. Lauro, Minhua Lu, Da-Yuan Shih | 2015-07-14 |
| 8691685 | Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present | Da-Yuan Shih, Yoon Chul SON | 2014-04-08 |
| 8679964 | Prevention and control of intermetallic alloy inclusions | Da-Yuan Shih, Yoon Chul SON | 2014-03-25 |
| 8679899 | Multipath soldered thermal interface between a chip and its heat sink | George Liang-Tai Chiu | 2014-03-25 |
| 8314500 | Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more | 2012-11-20 |
| 8157158 | Modification of solder alloy compositions to suppress interfacial void formation in solder joints | Peter A. Gruber, Donald W. Henderson, Da-Yuan Shih | 2012-04-17 |
| 8026613 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Stephen Kilpatrick, Paul A. Lauro, Henry A. Nye, III +2 more | 2011-09-27 |
| 7932169 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more | 2011-04-26 |
| 7923849 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Stephen Kilpatrick, Paul A. Lauro, Henry A. Nye, III +2 more | 2011-04-12 |
| 7820488 | Microelectronic devices and methods | Sri M. Sri-Jayantha, Gareth G. Hougham, Lawrence S. Mok, Hien Dang, Arun Sharma | 2010-10-26 |
| 7815968 | Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation | Gareth G. Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Jon A. Casey, Claudius Feger +5 more | 2010-10-19 |
| 7784669 | Method and process for reducing undercooling in a lead-free tin-rich solder alloy | Gareth G. Hougham, Kamalesh K. Srivastava, Da-Yuan Shih, Brian R. Sundlof, S. Jay Chey +4 more | 2010-08-31 |
| 7703661 | Method and process for reducing undercooling in a lead-free tin-rich solder alloy | Gareth G. Hougham, Kamalesh K. Srivastava, Da-Yuan Shih, Brian R. Sundlof, S. Jay Chey +4 more | 2010-04-27 |
| 7523852 | Solder interconnect structure and method using injection molded solder | Stephen L. Buchwalter, Claudius Feger, Peter A. Gruber, Paul A. Lauro, Da-Yuan Shih | 2009-04-28 |
| 7467742 | Electrically conducting adhesives for via fill applications | Jeffrey D. Gelorme, Konstantinos I. Papathomas, Sampath Purushothaman | 2008-12-23 |
| 7452568 | Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation | Gareth G. Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Jon A. Casey, Claudius Feger +5 more | 2008-11-18 |
| 7410833 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Stephen Kilpatrick, Paul A. Lauro, Henry A. Nye, III +2 more | 2008-08-12 |
| 7329948 | Microelectronic devices and methods | Sri M. Sri-Jayantha, Gareth G. Hougham, Lawrence S. Mok, Hien Dang, Arun Sharma | 2008-02-12 |
| 7273803 | Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure | Yu-Ting Cheng, Stefanie Chiras, Donald W. Henderson, Stephen Kilpatrick, Henry A. Nye, III +2 more | 2007-09-25 |
| 7115996 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped | Daniel C. Edelstein, Maurice McGlashan-Powell, Eugene J. O'Sullivan, George F. Walker | 2006-10-03 |
| 7079393 | Fluidic cooling systems and methods for electronic components | Evan G. Colgan, Frank L. Pompeo, Glenn G. Daves, Hilton T. Toy, Bruce K. Furman +7 more | 2006-07-18 |