Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026613 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro +2 more | 2011-09-27 |
| 7923849 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro +2 more | 2011-04-12 |
| 7517736 | Structure and method of chemically formed anchored metallic vias | Sanjay C. Mehta, Daniel C. Edelstein, John A. Fitzsimmons, Stephan Grunow, David L. Rath | 2009-04-14 |
| 7410833 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro +2 more | 2008-08-12 |
| 7276296 | Immersion plating and plated structures | Emanuel I. Cooper, Charles C. Goldsmith, Stephen Kilpatrick, Carmen M. Mojica | 2007-10-02 |
| 7273803 | Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure | Yu-Ting Cheng, Stefanie Chiras, Donald W. Henderson, Sung Kwon Kang, Stephen Kilpatrick +2 more | 2007-09-25 |
| 7037559 | Immersion plating and plated structures | Emanuel I. Cooper, Charles C. Goldsmith, Stephen Kilpatrick, Carmen M. Mojica | 2006-05-02 |
| 6946379 | Insulative cap for laser fusing | Timothy H. Daubenspeck, Thomas L. McDevitt, William T. Motsiff | 2005-09-20 |
| 6908841 | Support structures for wirebond regions of contact pads over low modulus materials | Lloyd Burrell, Douglas W. Kemerer, Hans-Joachim Barth, Emmanuel F. Crabbe, David F. Anderson +1 more | 2005-06-21 |
| 6900142 | Inhibition of tin oxide formation in lead free interconnect formation | Emanual I. Cooper, John M. Cotte, Lisa A. Fanti, David E. Eichstadt, Stephen Kilpatrick +1 more | 2005-05-31 |
| 6821890 | Method for improving adhesion to copper | Vincent J. McGahay, Thomas Ivers, Joyce C. Liu | 2004-11-23 |
| 6784516 | Insulative cap for laser fusing | Timothy H. Daubenspeck, Thomas L. McDevitt, William T. Motsiff | 2004-08-31 |
| 6531759 | Alpha particle shield for integrated circuit | Richard A. Wachnik, Charles R. Davis, Theodore H. Zabel, Phillip J. Restle | 2003-03-11 |
| 6486557 | Hybrid dielectric structure for improving the stiffness of back end of the line structures | Charles R. Davis, Daniel C. Edelstein, John C. Hay, Jr., Jeffrey Hedrick, Christopher V. Jahnes +1 more | 2002-11-26 |
| 6478212 | Bond pad structure and method for reduced downward force wirebonding | Brett H. Engel, Vincent J. McGahay | 2002-11-12 |
| 6271595 | Method for improving adhesion to copper | Vincent J. McGahay, Thomas Ivers, Joyce C. Liu | 2001-08-07 |
| 6261945 | Crackstop and oxygen barrier for low-K dielectric integrated circuits | Vincent J. McGahay, Kurt A. Tallman | 2001-07-17 |
| 6133136 | Robust interconnect structure | Daniel C. Edelstein, Vincent J. McGahay, Brian George Reid Ottey, William H. Price | 2000-10-17 |
| 5904156 | Dry film resist removal in the presence of electroplated C4's | Gerald G. Advocate, Jr., Lisa A. Fanti | 1999-05-18 |
| 5629564 | Electroplated solder terminal | Jeffrey F. Roeder, Ho-Ming Tong, Paul A. Totta | 1997-05-13 |
| 5503286 | Electroplated solder terminal | Jeffrey F. Roeder, Ho-Ming Tong, Paul A. Totta | 1996-04-02 |
| 5268072 | Etching processes for avoiding edge stress in semiconductor chip solder bumps | Birendra Agarwala, Madhav Datta, Richard E. Gegenwarth, Christopher V. Jahnes, Patrick M. Miller +2 more | 1993-12-07 |